Simulation and Verification of Coupled Heat and Moisture Modeling

N.L. Williams Portal, M.A.P. Aarle, van, A.W.M. Schijndel, van

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Abstract

The modeling of coupled heat and moisture transport is found to be a valuable method in which possible damage-related processes in building materials and components can be predicted. This paper includes the implementation and comparison of two types of moisture potentials used in the modeling of coupled heat and moisture transport: the natural logarithmic of the suction pressure (LPc) and the relative humidity (Rh). Two finite element models evaluating the coupled thermal and hygric transport have been developed using COMSOL Multiphysics®. The two developed models were verified with the normative benchmark test of European Provisional Standard prEN 15026. These models appear to be valid predictive tools to investigate the impact of a change in climatic conditions on building materials and components.
Original languageEnglish
Title of host publicationEuropean Comsol Conference, Stuttgart, 26-28 October 2011
Pages1-6
Publication statusPublished - 2011
Event2011European COMSOL Conference, October 26-28, 2011, Stuttgart, Germany - Stuttgart, Germany
Duration: 26 Oct 201128 Oct 2011
http://www.michelsencentre.com/doc/PDF%20dokumenter/COMSOL/COMSOLConference2011Stuttgart.pdf

Conference

Conference2011European COMSOL Conference, October 26-28, 2011, Stuttgart, Germany
CountryGermany
CityStuttgart
Period26/10/1128/10/11
OtherEuropean COMSOL Conference 2011
Internet address

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