Silicon micromachined hollow microneedles for transdermal liquid transport

J.G.E. Gardeniers, R. Luttge, J.W. Berenschot, M.J. Boer, de, S.Y. Yeshurun, M. Hefetz, R. Oever, van't, A. Berg, van den

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Abstract

This paper presents a novel process for the fabrication of out-of-plane hollow micro needles in silicon. The fabrication method consists of a sequence of deep-reactive ion etching (DRIE), anisotropic wet etching and conformal thin film deposition, and allows needle shapes with different, lithography-defined tip curvature. In this study, the length of the needles varied between 150 and 350 micrometers. The widest dimension of the needle at its base was 250 µm. Preliminary application tests of the needle arrays show that they are robust and permit skin penetration without breakage. Transdermal water loss measurements before and after microneedle skin penetration are reported. Drug delivery is increased approximately by a factor of 750 in microneedle patch applications with respect to diffusion alone. The feasibility of using the microneedle array as a blood sampler on a capillary electrophoresis chip is demonstrated.
Original languageEnglish
Pages (from-to)855-862
JournalJournal of Microelectromechanical Systems
Volume12
Issue number6
DOIs
Publication statusPublished - 2003

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Needles
Silicon
Liquids
Skin
Fabrication
Anisotropic etching
Capillary electrophoresis
Wet etching
Reactive ion etching
Drug delivery
Lithography
Blood
Thin films
Water

Cite this

Gardeniers, J. G. E., Luttge, R., Berenschot, J. W., Boer, de, M. J., Yeshurun, S. Y., Hefetz, M., ... Berg, van den, A. (2003). Silicon micromachined hollow microneedles for transdermal liquid transport. Journal of Microelectromechanical Systems, 12(6), 855-862. https://doi.org/10.1109/JMEMS.2003.820293
Gardeniers, J.G.E. ; Luttge, R. ; Berenschot, J.W. ; Boer, de, M.J. ; Yeshurun, S.Y. ; Hefetz, M. ; Oever, van't, R. ; Berg, van den, A. / Silicon micromachined hollow microneedles for transdermal liquid transport. In: Journal of Microelectromechanical Systems. 2003 ; Vol. 12, No. 6. pp. 855-862.
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title = "Silicon micromachined hollow microneedles for transdermal liquid transport",
abstract = "This paper presents a novel process for the fabrication of out-of-plane hollow micro needles in silicon. The fabrication method consists of a sequence of deep-reactive ion etching (DRIE), anisotropic wet etching and conformal thin film deposition, and allows needle shapes with different, lithography-defined tip curvature. In this study, the length of the needles varied between 150 and 350 micrometers. The widest dimension of the needle at its base was 250 µm. Preliminary application tests of the needle arrays show that they are robust and permit skin penetration without breakage. Transdermal water loss measurements before and after microneedle skin penetration are reported. Drug delivery is increased approximately by a factor of 750 in microneedle patch applications with respect to diffusion alone. The feasibility of using the microneedle array as a blood sampler on a capillary electrophoresis chip is demonstrated.",
author = "J.G.E. Gardeniers and R. Luttge and J.W. Berenschot and {Boer, de}, M.J. and S.Y. Yeshurun and M. Hefetz and {Oever, van't}, R. and {Berg, van den}, A.",
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Gardeniers, JGE, Luttge, R, Berenschot, JW, Boer, de, MJ, Yeshurun, SY, Hefetz, M, Oever, van't, R & Berg, van den, A 2003, 'Silicon micromachined hollow microneedles for transdermal liquid transport', Journal of Microelectromechanical Systems, vol. 12, no. 6, pp. 855-862. https://doi.org/10.1109/JMEMS.2003.820293

Silicon micromachined hollow microneedles for transdermal liquid transport. / Gardeniers, J.G.E.; Luttge, R.; Berenschot, J.W.; Boer, de, M.J.; Yeshurun, S.Y.; Hefetz, M.; Oever, van't, R.; Berg, van den, A.

In: Journal of Microelectromechanical Systems, Vol. 12, No. 6, 2003, p. 855-862.

Research output: Contribution to journalArticleAcademicpeer-review

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T1 - Silicon micromachined hollow microneedles for transdermal liquid transport

AU - Gardeniers, J.G.E.

AU - Luttge, R.

AU - Berenschot, J.W.

AU - Boer, de, M.J.

AU - Yeshurun, S.Y.

AU - Hefetz, M.

AU - Oever, van't, R.

AU - Berg, van den, A.

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AB - This paper presents a novel process for the fabrication of out-of-plane hollow micro needles in silicon. The fabrication method consists of a sequence of deep-reactive ion etching (DRIE), anisotropic wet etching and conformal thin film deposition, and allows needle shapes with different, lithography-defined tip curvature. In this study, the length of the needles varied between 150 and 350 micrometers. The widest dimension of the needle at its base was 250 µm. Preliminary application tests of the needle arrays show that they are robust and permit skin penetration without breakage. Transdermal water loss measurements before and after microneedle skin penetration are reported. Drug delivery is increased approximately by a factor of 750 in microneedle patch applications with respect to diffusion alone. The feasibility of using the microneedle array as a blood sampler on a capillary electrophoresis chip is demonstrated.

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