Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm2 bandwidth density

C. Li; O. Raz; F. Kraemer; R. Stabile

doi:10.1109/ECOC.2018.8535470

Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm²bandwidth density

C. Li, O. Raz, F. Kraemer, R. Stabile

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

117 Downloads (Pure)

Abstract

Through a single optical interface, a 250 μm pitch two-dimensional 2×8-channel optical transceiver is integrated on a lithographically patterned silicon interposer, offering 200 Gb/s data input and output duplex within an area of 6 mm×6 mm.

Original language	English
Title of host publication	2018 European Conference on Optical Communication, ECOC 2018
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Number of pages	3
ISBN (Electronic)	978-1-5386-4862-9
ISBN (Print)	978-1-5386-4863-6
DOIs	https://doi.org/10.1109/ECOC.2018.8535470
Publication status	Published - 14 Nov 2018
Event	2018 European Conference on Optical Communication, ECOC 2018 - Rome, Italy Duration: 23 Sep 2018 → 27 Sep 2018 Conference number: 44 https://www.ecoc2018.org/

Conference

Conference	2018 European Conference on Optical Communication, ECOC 2018
Abbreviated title	ECOC
Country	Italy
City	Rome
Period	23/09/18 → 27/09/18
Internet address	https://www.ecoc2018.org/

Keywords

elemental semiconductors
integrated optoelectronics
optical transceivers
photolithography
silicon
single optical interface
optical transceiver
lithographically patterned silicon interposer
bandwidth density
silicon interposer based QSFP-DD transceiver demonstrator
Integrated optics
Optical fibers
Silicon
Optical crosstalk
Optical reflection
Transceivers

Access to Document

10.1109/ECOC.2018.8535470

publishers versionFinal published version, 461 KB

Link to publication in Scopus

Fingerprint Dive into the research topics of 'Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm<sup>2 </sup>bandwidth density'. Together they form a unique fingerprint.

1 Active

PASSION
Calabretta, N., Raz, O., Stabile, R., Tessema, N. M., Li, C. & Calabretta, N.
1/12/17 → 31/05/21
Project: Research direct

Cite this

@inproceedings{fc22708dde764746847546d0f6c9a405,

title = "Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm2 bandwidth density",

abstract = "Through a single optical interface, a 250 μm pitch two-dimensional 2×8-channel optical transceiver is integrated on a lithographically patterned silicon interposer, offering 200 Gb/s data input and output duplex within an area of 6 mm×6 mm.",

keywords = "elemental semiconductors, integrated optoelectronics, optical transceivers, photolithography, silicon, single optical interface, optical transceiver, lithographically patterned silicon interposer, bandwidth density, silicon interposer based QSFP-DD transceiver demonstrator, Integrated optics, Optical fibers, Silicon, Optical crosstalk, Optical reflection, Transceivers",

author = "C. Li and O. Raz and F. Kraemer and R. Stabile",

year = "2018",

month = nov,

day = "14",

doi = "10.1109/ECOC.2018.8535470",

language = "English",

isbn = "978-1-5386-4863-6",

booktitle = "2018 European Conference on Optical Communication, ECOC 2018",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2018 European Conference on Optical Communication, ECOC 2018, ECOC ; Conference date: 23-09-2018 Through 27-09-2018",

url = "https://www.ecoc2018.org/",

}

Li, C , Raz, O, Kraemer, F & Stabile, R 2018, Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm²bandwidth density. in 2018 European Conference on Optical Communication, ECOC 2018., 8535470, Institute of Electrical and Electronics Engineers, Piscataway, 2018 European Conference on Optical Communication, ECOC 2018, Rome, Italy, 23/09/18. https://doi.org/10.1109/ECOC.2018.8535470

Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm²bandwidth density. / Li, C.; Raz, O.; Kraemer, F.; Stabile, R.

2018 European Conference on Optical Communication, ECOC 2018. Piscataway : Institute of Electrical and Electronics Engineers, 2018. 8535470.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm2 bandwidth density

AU - Li, C.

AU - Raz, O.

AU - Kraemer, F.

AU - Stabile, R.

N1 - Conference code: 44

PY - 2018/11/14

Y1 - 2018/11/14

N2 - Through a single optical interface, a 250 μm pitch two-dimensional 2×8-channel optical transceiver is integrated on a lithographically patterned silicon interposer, offering 200 Gb/s data input and output duplex within an area of 6 mm×6 mm.

AB - Through a single optical interface, a 250 μm pitch two-dimensional 2×8-channel optical transceiver is integrated on a lithographically patterned silicon interposer, offering 200 Gb/s data input and output duplex within an area of 6 mm×6 mm.

KW - elemental semiconductors

KW - integrated optoelectronics

KW - optical transceivers

KW - photolithography

KW - silicon

KW - single optical interface

KW - optical transceiver

KW - lithographically patterned silicon interposer

KW - bandwidth density

KW - silicon interposer based QSFP-DD transceiver demonstrator

KW - Integrated optics

KW - Optical fibers

KW - Silicon

KW - Optical crosstalk

KW - Optical reflection

KW - Transceivers

UR - http://www.scopus.com/inward/record.url?scp=85063227832&partnerID=8YFLogxK

U2 - 10.1109/ECOC.2018.8535470

DO - 10.1109/ECOC.2018.8535470

M3 - Conference contribution

SN - 978-1-5386-4863-6

BT - 2018 European Conference on Optical Communication, ECOC 2018

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - 2018 European Conference on Optical Communication, ECOC 2018

Y2 - 23 September 2018 through 27 September 2018

ER -