Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm2 bandwidth density

C. Li, O. Raz, F. Kraemer, R. Stabile

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

117 Downloads (Pure)

Abstract

Through a single optical interface, a 250 μm pitch two-dimensional 2×8-channel optical transceiver is integrated on a lithographically patterned silicon interposer, offering 200 Gb/s data input and output duplex within an area of 6 mm×6 mm.
Original languageEnglish
Title of host publication2018 European Conference on Optical Communication, ECOC 2018
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Number of pages3
ISBN (Electronic)978-1-5386-4862-9
ISBN (Print)978-1-5386-4863-6
DOIs
Publication statusPublished - 14 Nov 2018
Event2018 European Conference on Optical Communication, ECOC 2018 - Rome, Italy
Duration: 23 Sep 201827 Sep 2018
Conference number: 44
https://www.ecoc2018.org/

Conference

Conference2018 European Conference on Optical Communication, ECOC 2018
Abbreviated titleECOC
CountryItaly
CityRome
Period23/09/1827/09/18
Internet address

Keywords

  • elemental semiconductors
  • integrated optoelectronics
  • optical transceivers
  • photolithography
  • silicon
  • single optical interface
  • optical transceiver
  • lithographically patterned silicon interposer
  • bandwidth density
  • silicon interposer based QSFP-DD transceiver demonstrator
  • Integrated optics
  • Optical fibers
  • Silicon
  • Optical crosstalk
  • Optical reflection
  • Transceivers

Fingerprint Dive into the research topics of 'Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm<sup>2 </sup>bandwidth density'. Together they form a unique fingerprint.

Cite this