Projects per year
Abstract
Through a single optical interface, a 250 μm pitch two-dimensional 2×8-channel optical transceiver is integrated on a lithographically patterned silicon interposer, offering 200 Gb/s data input and output duplex within an area of 6 mm×6 mm.
Original language | English |
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Title of host publication | 2018 European Conference on Optical Communication, ECOC 2018 |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Number of pages | 3 |
ISBN (Electronic) | 978-1-5386-4862-9 |
ISBN (Print) | 978-1-5386-4863-6 |
DOIs | |
Publication status | Published - 14 Nov 2018 |
Event | 44th European Conference on Optical Communication (ECOC 2018) - Rome, Italy Duration: 23 Sept 2018 → 27 Sept 2018 Conference number: 44 https://www.ecoc2018.org/ |
Conference
Conference | 44th European Conference on Optical Communication (ECOC 2018) |
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Abbreviated title | ECOC 2018 |
Country/Territory | Italy |
City | Rome |
Period | 23/09/18 → 27/09/18 |
Internet address |
Keywords
- elemental semiconductors
- integrated optoelectronics
- optical transceivers
- photolithography
- silicon
- single optical interface
- optical transceiver
- lithographically patterned silicon interposer
- bandwidth density
- silicon interposer based QSFP-DD transceiver demonstrator
- Integrated optics
- Optical fibers
- Silicon
- Optical crosstalk
- Optical reflection
- Transceivers
Fingerprint
Dive into the research topics of 'Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm2 bandwidth density'. Together they form a unique fingerprint.Projects
- 1 Finished
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PASSION
Calabretta, N., Raz, O., Stabile, R., Tessema, N. M., Li, C. & Mukit, M.
1/12/17 → 31/05/21
Project: Research direct