The papers included in this issue of ECS Transactions were originally presented during the
11th international symposium on “Silicon Compatible Emerging Materials, Processes, and
Technologies for Advanced CMOS and Post-CMOS Applications.” The symposium was held as part
of the 239th ECS Meeting with the 18th International Meeting on Chemical Sensors (IMCS), from
May 30-June 3, 2021. The meeting was originally planned for Chicago, Illinois, and was moved to a
digital platform due to the ongoing COVID-19 pandemic.
In line with the transforming technological landscape, this year’s symposium continues to
focus on novel materials, advanced devices, and critical FEOL and BEOL technologies to enable
advanced integrated circuits. The symposium featured beyond CMOS technology focusing on nonvolatile
memory/switching elements, such as phase change and ferroelectrics for neuromorphic
computing, machine/artificial intelligence, and quantum computing. Topics on heterogeneous and 3D
integration for advanced packaging enabling 3D stackings of chips with different functionality were
also featured during this year’s symposium.
The organizers would like to express their gratitude to the ECS staff, all speakers, invited and
contributing, for their interest in this symposium, and for submitting high-quality abstracts and
preparing their manuscripts. The organizers would also like express their gratitude to the digital
meeting attendees, and the entire community overall for their support, resilience, and commitment to
the Society. Finally, the success of the symposium is greatly and positively influenced by the financial
support given by the sponsoring ECS divisions, Electronics and Photonics (lead sponsor) and
Dielectric Science & Technology, as well as our industrial sponsors Yield Engineering Systems, Inc.
(YES) and Mattson Technology, Inc.. Their loyal support and sponsorship are highly appreciated. The
strong interest and participation seen this year is a testament to your dedication and efforts to help
advance technology for solving the challenges of the present and future.