Semiconductor-Core Metal

C.Z. Ning, M.T. Hill, M.J.H. Marell, E.S.P. Leong, E. Smalbrugge, Y. Zhu, Minghua Sun, P.J. Veldhoven, van, E.J. Geluk, F. Karouta, Y.S. Oei, H. Wang, K. Ding, R. Liu, R. Nötzel, M.K. Smit

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Abstract

No abstract.
Original languageEnglish
Title of host publicationAtomic layer deposition applications 5 : Proceedings of the 216th ECS meeting, 4 - 9 October 2009, Vienna, Austria
EditorsS. Bent, S. De Gendt
Place of PublicationPennington, NJ
PublisherElectrochemical Society
Pages2292-(E8) S2
ISBN (Print)978-1-566-77741-4
Publication statusPublished - 2009
Event216th Electrochemical Society Meeting (ECS 2009) - Vienna, Austria
Duration: 4 Oct 20099 Oct 2009
Conference number: 216
https://www.electrochem.org/216

Conference

Conference216th Electrochemical Society Meeting (ECS 2009)
Abbreviated titleECS 2009)
CountryAustria
CityVienna
Period4/10/099/10/09
Internet address

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    Ning, C. Z., Hill, M. T., Marell, M. J. H., Leong, E. S. P., Smalbrugge, E., Zhu, Y., Sun, M., Veldhoven, van, P. J., Geluk, E. J., Karouta, F., Oei, Y. S., Wang, H., Ding, K., Liu, R., Nötzel, R., & Smit, M. K. (2009). Semiconductor-Core Metal. In S. Bent, & S. De Gendt (Eds.), Atomic layer deposition applications 5 : Proceedings of the 216th ECS meeting, 4 - 9 October 2009, Vienna, Austria (pp. 2292-(E8) S2). Electrochemical Society.