Abstract
The invention relates to a process for providing a semiconducting device comprising the steps of depositing a semiconducting layer onto a substrate by means of heating a gas to a predetermined, dissociation temperature so that the gas dissociates into fractions, whereby these fractions subsequently condense on the substrate to build up a semiconducting layer.
Original language | English |
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Patent number | US2002132411 |
IPC | H01L 31/ 04 A I |
Priority date | 18/12/97 |
Publication status | Published - 19 Sept 2002 |
Externally published | Yes |