Semi-analytic approximation of the temperature field resulting from moving heat loads

D.W.M. Veldman, R.H.B. Fey, H.J. Zwart, M.M.J. van de Wal, J.D.B.J. van den Boom, H. Nijmeijer

Research output: Contribution to journalArticleAcademicpeer-review

17 Citations (Scopus)
239 Downloads (Pure)


Moving heat load problems appear in many manufacturing processes, such as lithography, welding, grinding, and additive manufacturing. The simulation of moving heat load problems by the finite-element method poses several numerical challenges, which may lead to time consuming computations. In this paper, we propose a 2D semi-analytic model in which the problem in two spatial dimensions is decoupled into three problems in one spatial dimension. This decoupling significantly reduces the computational time, but also introduces an additional error. The method is applied to a wafer heating example, in which the computational time is reduced by a factor 10 at the cost of a 4% error in the temperature field.

Original languageEnglish
Pages (from-to)128-137
Number of pages10
JournalInternational Journal of Heat and Mass Transfer
Publication statusPublished - 1 Jul 2018


  • Finite elements
  • Moving heat source
  • Wafer heating


Dive into the research topics of 'Semi-analytic approximation of the temperature field resulting from moving heat loads'. Together they form a unique fingerprint.

Cite this