Abstract
The resist image quality produced by step-and-scan exposure tools depends upon the performance of the synchronized wafer and reticle stages as much as on the quality of the optics. Achieving high throughput and sub-quarter micron resolution requires careful stage engineering.
| Original language | English |
|---|---|
| Pages (from-to) | 8-16 |
| Journal | Microlithography World |
| Volume | 8 |
| Issue number | 2 |
| Publication status | Published - 1999 |