Scaling optical interconnects to meet the bandwidth density crunch

O. Raz, C. Li, T. Li, N. Calabretta, G. Guelbenzu De Villota, R. Stabile

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)
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Abstract

Many high performance computers (HPC) and cloud computing applications rely on distributing tasks among large numbers of virtual and real servers. This implies that advancements in performance of data centers and HPCs is increasingly dependent on connectivity. In order to insure high degree of connectivity at increasing bit rates and distances the demand for large bandwidth-distance product connections is increasing. These can almost exclusively be provided using optical interconnects. Traditionally optical-interconnect come in the form of pluggable transceivers. However the increases in number of connections and bit-rate poses a limit to further scaling (the front-plate bottleneck). A shift towards mid-board optics is in the making but requires solutions which are compact, power efficient and low cost for manufacturing. In this talk we will present our most recent demonstrations of high density optical interconnect solutions as well as high density switches. First some details about the design aspects and advantages of compact electronic switches employing mid-board optical engines will be discussed. Then, for addressing the challenge of low cost optical interconnects, we will give details on our recent work targeting high channel count VCSELs based sub-modules. Results based on 2.5D and 3D assembly on high resistivity silicon will be discussed as well as the use of direct die attach to flexible PCBs for making high density interconnects.

Original languageEnglish
Title of host publicationMetro and Data Center Optical Networks and Short-Reach Links
PublisherSPIE
Number of pages8
Volume10560
ISBN (Electronic)9781510616059
DOIs
Publication statusPublished - 1 Jan 2018
EventMetro and Data Center Optical Networks and Short-Reach Links 2018 - San Francisco, United States
Duration: 30 Jan 201831 Jan 2018

Conference

ConferenceMetro and Data Center Optical Networks and Short-Reach Links 2018
CountryUnited States
CitySan Francisco
Period30/01/1831/01/18

Fingerprint

Optical Interconnects
optical interconnects
Optical interconnects
Bandwidth
Scaling
bandwidth
scaling
Switch
Connectivity
Switches
switching circuits
Vertical-cavity Surface-emitting Laser (VCSEL)
polychlorinated biphenyls
distributing
Data Center
Polychlorinated Biphenyls
Surface emitting lasers
transmitter receivers
Resistivity
Silicon

Keywords

  • 3D stacking
  • Data centers
  • Direct die attach
  • Optical interconnects
  • VCSELs

Cite this

Raz, O., Li, C., Li, T., Calabretta, N., Guelbenzu De Villota, G., & Stabile, R. (2018). Scaling optical interconnects to meet the bandwidth density crunch. In Metro and Data Center Optical Networks and Short-Reach Links (Vol. 10560). [105600B] SPIE. https://doi.org/10.1117/12.2295759
Raz, O. ; Li, C. ; Li, T. ; Calabretta, N. ; Guelbenzu De Villota, G. ; Stabile, R. / Scaling optical interconnects to meet the bandwidth density crunch. Metro and Data Center Optical Networks and Short-Reach Links. Vol. 10560 SPIE, 2018.
@inproceedings{725c561fe94946da8c5821df51433637,
title = "Scaling optical interconnects to meet the bandwidth density crunch",
abstract = "Many high performance computers (HPC) and cloud computing applications rely on distributing tasks among large numbers of virtual and real servers. This implies that advancements in performance of data centers and HPCs is increasingly dependent on connectivity. In order to insure high degree of connectivity at increasing bit rates and distances the demand for large bandwidth-distance product connections is increasing. These can almost exclusively be provided using optical interconnects. Traditionally optical-interconnect come in the form of pluggable transceivers. However the increases in number of connections and bit-rate poses a limit to further scaling (the front-plate bottleneck). A shift towards mid-board optics is in the making but requires solutions which are compact, power efficient and low cost for manufacturing. In this talk we will present our most recent demonstrations of high density optical interconnect solutions as well as high density switches. First some details about the design aspects and advantages of compact electronic switches employing mid-board optical engines will be discussed. Then, for addressing the challenge of low cost optical interconnects, we will give details on our recent work targeting high channel count VCSELs based sub-modules. Results based on 2.5D and 3D assembly on high resistivity silicon will be discussed as well as the use of direct die attach to flexible PCBs for making high density interconnects.",
keywords = "3D stacking, Data centers, Direct die attach, Optical interconnects, VCSELs",
author = "O. Raz and C. Li and T. Li and N. Calabretta and {Guelbenzu De Villota}, G. and R. Stabile",
year = "2018",
month = "1",
day = "1",
doi = "10.1117/12.2295759",
language = "English",
volume = "10560",
booktitle = "Metro and Data Center Optical Networks and Short-Reach Links",
publisher = "SPIE",
address = "United States",

}

Raz, O, Li, C, Li, T, Calabretta, N, Guelbenzu De Villota, G & Stabile, R 2018, Scaling optical interconnects to meet the bandwidth density crunch. in Metro and Data Center Optical Networks and Short-Reach Links. vol. 10560, 105600B, SPIE, Metro and Data Center Optical Networks and Short-Reach Links 2018, San Francisco, United States, 30/01/18. https://doi.org/10.1117/12.2295759

Scaling optical interconnects to meet the bandwidth density crunch. / Raz, O.; Li, C.; Li, T.; Calabretta, N.; Guelbenzu De Villota, G.; Stabile, R.

Metro and Data Center Optical Networks and Short-Reach Links. Vol. 10560 SPIE, 2018. 105600B.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - Scaling optical interconnects to meet the bandwidth density crunch

AU - Raz, O.

AU - Li, C.

AU - Li, T.

AU - Calabretta, N.

AU - Guelbenzu De Villota, G.

AU - Stabile, R.

PY - 2018/1/1

Y1 - 2018/1/1

N2 - Many high performance computers (HPC) and cloud computing applications rely on distributing tasks among large numbers of virtual and real servers. This implies that advancements in performance of data centers and HPCs is increasingly dependent on connectivity. In order to insure high degree of connectivity at increasing bit rates and distances the demand for large bandwidth-distance product connections is increasing. These can almost exclusively be provided using optical interconnects. Traditionally optical-interconnect come in the form of pluggable transceivers. However the increases in number of connections and bit-rate poses a limit to further scaling (the front-plate bottleneck). A shift towards mid-board optics is in the making but requires solutions which are compact, power efficient and low cost for manufacturing. In this talk we will present our most recent demonstrations of high density optical interconnect solutions as well as high density switches. First some details about the design aspects and advantages of compact electronic switches employing mid-board optical engines will be discussed. Then, for addressing the challenge of low cost optical interconnects, we will give details on our recent work targeting high channel count VCSELs based sub-modules. Results based on 2.5D and 3D assembly on high resistivity silicon will be discussed as well as the use of direct die attach to flexible PCBs for making high density interconnects.

AB - Many high performance computers (HPC) and cloud computing applications rely on distributing tasks among large numbers of virtual and real servers. This implies that advancements in performance of data centers and HPCs is increasingly dependent on connectivity. In order to insure high degree of connectivity at increasing bit rates and distances the demand for large bandwidth-distance product connections is increasing. These can almost exclusively be provided using optical interconnects. Traditionally optical-interconnect come in the form of pluggable transceivers. However the increases in number of connections and bit-rate poses a limit to further scaling (the front-plate bottleneck). A shift towards mid-board optics is in the making but requires solutions which are compact, power efficient and low cost for manufacturing. In this talk we will present our most recent demonstrations of high density optical interconnect solutions as well as high density switches. First some details about the design aspects and advantages of compact electronic switches employing mid-board optical engines will be discussed. Then, for addressing the challenge of low cost optical interconnects, we will give details on our recent work targeting high channel count VCSELs based sub-modules. Results based on 2.5D and 3D assembly on high resistivity silicon will be discussed as well as the use of direct die attach to flexible PCBs for making high density interconnects.

KW - 3D stacking

KW - Data centers

KW - Direct die attach

KW - Optical interconnects

KW - VCSELs

UR - http://www.scopus.com/inward/record.url?scp=85049502151&partnerID=8YFLogxK

U2 - 10.1117/12.2295759

DO - 10.1117/12.2295759

M3 - Conference contribution

AN - SCOPUS:85049502151

VL - 10560

BT - Metro and Data Center Optical Networks and Short-Reach Links

PB - SPIE

ER -

Raz O, Li C, Li T, Calabretta N, Guelbenzu De Villota G, Stabile R. Scaling optical interconnects to meet the bandwidth density crunch. In Metro and Data Center Optical Networks and Short-Reach Links. Vol. 10560. SPIE. 2018. 105600B https://doi.org/10.1117/12.2295759