Robust iterative finite element solver for multi-terminal power distribution network resistance extraction

M. Oppeneer, P. Sumant, A.C. Cangellaris

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    7 Citations (Scopus)

    Abstract

    A node-based algebraic multi-grid finite element Laplace solver is demonstrated for the extraction of the multi-terminal DC resistance of the power distribution network at the board and package level. The solver can handle boards of arbitrary complexity, comprehending without numerical difficulties fine features associated with dense clusters of via holes and related voids in the metallization.
    Original languageEnglish
    Title of host publicationElectrical Performance of Electronic Packaging, 2008 IEEE-EPEP
    PublisherInstitute of Electrical and Electronics Engineers
    Pages181-184
    ISBN (Print)978-1-4244-2873-1
    DOIs
    Publication statusPublished - 2008
    Event17th Conference on Electrical Performance of Electronic Packaging (EPEP 2008) - San Jose, United States
    Duration: 27 Oct 200829 Oct 2008
    Conference number: 17

    Conference

    Conference17th Conference on Electrical Performance of Electronic Packaging (EPEP 2008)
    Abbreviated titleEPEP 2008
    CountryUnited States
    CitySan Jose
    Period27/10/0829/10/08

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