Robust iterative finite element solver for multi-terminal power distribution network resistance extraction

M. Oppeneer; P. Sumant; A.C. Cangellaris

doi:10.1109/EPEP.2008.4675908

Robust iterative finite element solver for multi-terminal power distribution network resistance extraction

M. Oppeneer, P. Sumant, A.C. Cangellaris

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

7 Citations (Scopus)

Abstract

A node-based algebraic multi-grid finite element Laplace solver is demonstrated for the extraction of the multi-terminal DC resistance of the power distribution network at the board and package level. The solver can handle boards of arbitrary complexity, comprehending without numerical difficulties fine features associated with dense clusters of via holes and related voids in the metallization.

Original language	English
Title of host publication	Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Publisher	Institute of Electrical and Electronics Engineers
Pages	181-184
ISBN (Print)	978-1-4244-2873-1
DOIs	https://doi.org/10.1109/EPEP.2008.4675908
Publication status	Published - 2008
Event	17th Conference on Electrical Performance of Electronic Packaging (EPEP 2008) - San Jose, United States Duration: 27 Oct 2008 → 29 Oct 2008 Conference number: 17

Conference

Conference	17th Conference on Electrical Performance of Electronic Packaging (EPEP 2008)
Abbreviated title	EPEP 2008
Country/Territory	United States
City	San Jose
Period	27/10/08 → 29/10/08

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10.1109/EPEP.2008.4675908

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title = "Robust iterative finite element solver for multi-terminal power distribution network resistance extraction",

abstract = "A node-based algebraic multi-grid finite element Laplace solver is demonstrated for the extraction of the multi-terminal DC resistance of the power distribution network at the board and package level. The solver can handle boards of arbitrary complexity, comprehending without numerical difficulties fine features associated with dense clusters of via holes and related voids in the metallization.",

author = "M. Oppeneer and P. Sumant and A.C. Cangellaris",

year = "2008",

doi = "10.1109/EPEP.2008.4675908",

language = "English",

isbn = "978-1-4244-2873-1",

publisher = "Institute of Electrical and Electronics Engineers",

pages = "181--184",

booktitle = "Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP",

address = "United States",

note = "17th Conference on Electrical Performance of Electronic Packaging (EPEP 2008), EPEP 2008 ; Conference date: 27-10-2008 Through 29-10-2008",

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Oppeneer, M, Sumant, P & Cangellaris, AC 2008, Robust iterative finite element solver for multi-terminal power distribution network resistance extraction. in Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP. Institute of Electrical and Electronics Engineers, pp. 181-184, 17th Conference on Electrical Performance of Electronic Packaging (EPEP 2008), San Jose, California, United States, 27/10/08. https://doi.org/10.1109/EPEP.2008.4675908

Robust iterative finite element solver for multi-terminal power distribution network resistance extraction. / Oppeneer, M.; Sumant, P.; Cangellaris, A.C.
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP. Institute of Electrical and Electronics Engineers, 2008. p. 181-184.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Oppeneer, M.

AU - Sumant, P.

AU - Cangellaris, A.C.

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PY - 2008

Y1 - 2008

N2 - A node-based algebraic multi-grid finite element Laplace solver is demonstrated for the extraction of the multi-terminal DC resistance of the power distribution network at the board and package level. The solver can handle boards of arbitrary complexity, comprehending without numerical difficulties fine features associated with dense clusters of via holes and related voids in the metallization.

AB - A node-based algebraic multi-grid finite element Laplace solver is demonstrated for the extraction of the multi-terminal DC resistance of the power distribution network at the board and package level. The solver can handle boards of arbitrary complexity, comprehending without numerical difficulties fine features associated with dense clusters of via holes and related voids in the metallization.

U2 - 10.1109/EPEP.2008.4675908

DO - 10.1109/EPEP.2008.4675908

M3 - Conference contribution

SN - 978-1-4244-2873-1

SP - 181

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BT - Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP

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T2 - 17th Conference on Electrical Performance of Electronic Packaging (EPEP 2008)

Y2 - 27 October 2008 through 29 October 2008

ER -

Robust iterative finite element solver for multi-terminal power distribution network resistance extraction

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