Roadmap for integration of InP based photonics and silicon electronics

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

Abstract

We identify the synergies and a roadmap for the intimate integration of InP photonic integrated circuits and Silicon electronic ICs using wafer-scale processes. Advantages are foreseen in terms of bandwidth, energy savings and package simplification.
Original languageEnglish
Title of host publicationProceedings of the 41st European Conference on Optical Communication (ECOC 2015), 27 September - 1 October 2015, Valencia, Spain
Publication statusPublished - 2015
Event41st European Conference on Optical Communication, ECOC 2015 - Feria Valencia Convention and Exhibition Centre , Valencia, Spain
Duration: 27 Sep 20151 Oct 2015
Conference number: 41
http://www.ecoc2015.org/modules.php?name=webstructure&idwebstructure=1

Conference

Conference41st European Conference on Optical Communication, ECOC 2015
Abbreviated titleECOC 2015
CountrySpain
CityValencia
Period27/09/151/10/15
Internet address

Bibliographical note

Workshop

Fingerprint Dive into the research topics of 'Roadmap for integration of InP based photonics and silicon electronics'. Together they form a unique fingerprint.

Cite this