Abstract
We identify the synergies and a roadmap for the intimate integration of InP photonic integrated circuits and Silicon electronic ICs using wafer-scale processes. Advantages are foreseen in terms of bandwidth, energy savings and package simplification.
| Original language | English |
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| Title of host publication | Proceedings of the 41st European Conference on Optical Communication (ECOC 2015), 27 September - 1 October 2015, Valencia, Spain |
| Publication status | Published - 2015 |
| Event | 41st European Conference on Optical Communication (ECOC 2015) - Feria Valencia Convention and Exhibition Centre , Valencia, Spain Duration: 27 Sept 2015 → 1 Oct 2015 Conference number: 41 http://www.ecoc2015.org/modules.php?name=webstructure&idwebstructure=1 |
Conference
| Conference | 41st European Conference on Optical Communication (ECOC 2015) |
|---|---|
| Abbreviated title | ECOC 2015 |
| Country/Territory | Spain |
| City | Valencia |
| Period | 27/09/15 → 1/10/15 |
| Internet address |