RFIDesk: An interactive surface for multi-touch and rich-ID stackable tangible interactions

Meng Ju Hsieh, Rong Hao Liang, Jr Ling Guo, Bing Yu Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

This work introduces RFIDesk, an interactive surface that enables both multi-touch and rich-ID stackable tangible interactions. By using ultra-high frequency (UHF) radio-frequency identification (RFID) technology, the RFIDesk can effectively identify the elements of a stack. Furthermore, this system integrates capacitive multitouch sensing based on indium tin oxide (ITO) to effectively detect touch events while preserving the interface transparency, thus enabling rich visual feedback to be displayed under the stackable objects. The interference between the two sensing technologies is resolved by applying time-division multiplexing sampling. We use a tangible tower-defense game to demonstrate the interaction possibilities of this system.

Original languageEnglish
Title of host publicationSA '18: The 11th ACM SIGGRAPH Conference and Exhibition on Computer Graphics and Interactive Techniques in Asia
Place of PublicationNew York
PublisherAssociation for Computing Machinery, Inc
Number of pages2
ISBN (Print)978-1-4503-6027-2
DOIs
Publication statusPublished - 4 Dec 2018
EventThe 11th ACM SIGGRAPH Conference and Exhibition on Computer Graphics and Interactive Techniques in Asia: SIGGRAPH Asia '18 - Tokyo, Japan
Duration: 4 Dec 20187 Dec 2018

Conference

ConferenceThe 11th ACM SIGGRAPH Conference and Exhibition on Computer Graphics and Interactive Techniques in Asia
CountryJapan
CityTokyo
Period4/12/187/12/18

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Keywords

  • Interactive surface
  • Stackable
  • Transparent

Cite this

Hsieh, M. J., Liang, R. H., Guo, J. L., & Chen, B. Y. (2018). RFIDesk: An interactive surface for multi-touch and rich-ID stackable tangible interactions. In SA '18: The 11th ACM SIGGRAPH Conference and Exhibition on Computer Graphics and Interactive Techniques in Asia [a11] New York: Association for Computing Machinery, Inc. https://doi.org/10.1145/3275476.3275491