RF SiP : the next wave for wireless system integration

A.B. Smolders, N.J. Pulsford, P. Philippe, F.E. van Straten

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

25 Citations (Scopus)
2 Downloads (Pure)


This paper discusses the opportunities of the system-in-package (SiP) concept for integrating complete wireless systems into a single package, providing the smallest size and lowest cost in the end application. SiPs offer the flexibility to use the optimal technology mixture for a particular wireless system. Two SiP approaches are introduced. The first approach is based on a low-cost laminate platform (LAMP) and the second approach uses a thin-film passive integration IC technology. In both approaches, multiple active dies (CMOS, BiCMOS, GaAs, etc.) can be placed on the passive substrate using either conventional wire-bonding technology or more advanced flip-chip technology. Two examples are described in the wireless connectivity area, i.e. a Bluetooth radio SiP and a complete WLAN 802.11b system SiP.
Original languageEnglish
Title of host publicationProceedings of the 2004 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Digest of Papers, 6-8 June 2004, Forth Worth, Texas
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Publication statusPublished - 2004
Event2004 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2004) - Forth Worth, United States
Duration: 6 Jun 20048 Jun 2004


Conference2004 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2004)
Abbreviated titleRFIC 2004
Country/TerritoryUnited States
CityForth Worth


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