RF SiP : the next wave for wireless system integration

A.B. Smolders; N.J. Pulsford; P. Philippe; F.E. van Straten

doi:10.1109/RFIC.2004.1320581

RF SiP : the next wave for wireless system integration

A.B. Smolders, N.J. Pulsford, P. Philippe, F.E. van Straten

Electromagnetics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

27 Citations (Scopus)

3 Downloads (Pure)

Abstract

This paper discusses the opportunities of the system-in-package (SiP) concept for integrating complete wireless systems into a single package, providing the smallest size and lowest cost in the end application. SiPs offer the flexibility to use the optimal technology mixture for a particular wireless system. Two SiP approaches are introduced. The first approach is based on a low-cost laminate platform (LAMP) and the second approach uses a thin-film passive integration IC technology. In both approaches, multiple active dies (CMOS, BiCMOS, GaAs, etc.) can be placed on the passive substrate using either conventional wire-bonding technology or more advanced flip-chip technology. Two examples are described in the wireless connectivity area, i.e. a Bluetooth radio SiP and a complete WLAN 802.11b system SiP.

Original language	English
Title of host publication	Proceedings of the 2004 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Digest of Papers, 6-8 June 2004, Forth Worth, Texas
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	233-236
DOIs	https://doi.org/10.1109/RFIC.2004.1320581
Publication status	Published - 2004
Event	2004 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2004) - Forth Worth, United States Duration: 6 Jun 2004 → 8 Jun 2004

Conference

Conference	2004 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2004)
Abbreviated title	RFIC 2004
Country/Territory	United States
City	Forth Worth
Period	6/06/04 → 8/06/04

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10.1109/RFIC.2004.1320581

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Smolders, A. B., Pulsford, N. J., Philippe, P., & van Straten, F. E. (2004). RF SiP : the next wave for wireless system integration. In Proceedings of the 2004 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Digest of Papers, 6-8 June 2004, Forth Worth, Texas (pp. 233-236). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/RFIC.2004.1320581

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title = "RF SiP : the next wave for wireless system integration",

abstract = "This paper discusses the opportunities of the system-in-package (SiP) concept for integrating complete wireless systems into a single package, providing the smallest size and lowest cost in the end application. SiPs offer the flexibility to use the optimal technology mixture for a particular wireless system. Two SiP approaches are introduced. The first approach is based on a low-cost laminate platform (LAMP) and the second approach uses a thin-film passive integration IC technology. In both approaches, multiple active dies (CMOS, BiCMOS, GaAs, etc.) can be placed on the passive substrate using either conventional wire-bonding technology or more advanced flip-chip technology. Two examples are described in the wireless connectivity area, i.e. a Bluetooth radio SiP and a complete WLAN 802.11b system SiP.",

author = "A.B. Smolders and N.J. Pulsford and P. Philippe and {van Straten}, F.E.",

year = "2004",

doi = "10.1109/RFIC.2004.1320581",

language = "English",

pages = "233--236",

booktitle = "Proceedings of the 2004 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Digest of Papers, 6-8 June 2004, Forth Worth, Texas",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2004 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2004), RFIC 2004 ; Conference date: 06-06-2004 Through 08-06-2004",

}

Smolders, AB, Pulsford, NJ, Philippe, P & van Straten, FE 2004, RF SiP : the next wave for wireless system integration. in Proceedings of the 2004 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Digest of Papers, 6-8 June 2004, Forth Worth, Texas. Institute of Electrical and Electronics Engineers, Piscataway, pp. 233-236, 2004 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2004), Forth Worth, Texas, United States, 6/06/04. https://doi.org/10.1109/RFIC.2004.1320581

RF SiP : the next wave for wireless system integration. / Smolders, A.B.; Pulsford, N.J.; Philippe, P. et al.
Proceedings of the 2004 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Digest of Papers, 6-8 June 2004, Forth Worth, Texas. Piscataway: Institute of Electrical and Electronics Engineers, 2004. p. 233-236.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Philippe, P.

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N2 - This paper discusses the opportunities of the system-in-package (SiP) concept for integrating complete wireless systems into a single package, providing the smallest size and lowest cost in the end application. SiPs offer the flexibility to use the optimal technology mixture for a particular wireless system. Two SiP approaches are introduced. The first approach is based on a low-cost laminate platform (LAMP) and the second approach uses a thin-film passive integration IC technology. In both approaches, multiple active dies (CMOS, BiCMOS, GaAs, etc.) can be placed on the passive substrate using either conventional wire-bonding technology or more advanced flip-chip technology. Two examples are described in the wireless connectivity area, i.e. a Bluetooth radio SiP and a complete WLAN 802.11b system SiP.

AB - This paper discusses the opportunities of the system-in-package (SiP) concept for integrating complete wireless systems into a single package, providing the smallest size and lowest cost in the end application. SiPs offer the flexibility to use the optimal technology mixture for a particular wireless system. Two SiP approaches are introduced. The first approach is based on a low-cost laminate platform (LAMP) and the second approach uses a thin-film passive integration IC technology. In both approaches, multiple active dies (CMOS, BiCMOS, GaAs, etc.) can be placed on the passive substrate using either conventional wire-bonding technology or more advanced flip-chip technology. Two examples are described in the wireless connectivity area, i.e. a Bluetooth radio SiP and a complete WLAN 802.11b system SiP.

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ER -

RF SiP : the next wave for wireless system integration

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