Abstract
This paper discusses the opportunities of the system-in-package (SiP) concept for integrating complete wireless systems into a single package, providing the smallest size and lowest cost in the end application. SiPs offer the flexibility to use the optimal technology mixture for a particular wireless system. Two SiP approaches are introduced. The first approach is based on a low-cost laminate platform (LAMP) and the second approach uses a thin-film passive integration IC technology. In both approaches, multiple active dies (CMOS, BiCMOS, GaAs, etc.) can be placed on the passive substrate using either conventional wire-bonding technology or more advanced flip-chip technology. Two examples are described in the wireless connectivity area, i.e. a Bluetooth radio SiP and a complete WLAN 802.11b system SiP.
Original language | English |
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Title of host publication | Proceedings of the 2004 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Digest of Papers, 6-8 June 2004, Forth Worth, Texas |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 233-236 |
DOIs | |
Publication status | Published - 2004 |
Event | 2004 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2004) - Forth Worth, United States Duration: 6 Jun 2004 → 8 Jun 2004 |
Conference
Conference | 2004 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2004) |
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Abbreviated title | RFIC 2004 |
Country/Territory | United States |
City | Forth Worth |
Period | 6/06/04 → 8/06/04 |