RF interconnects for high-speed and dense photonic integrated circuits

Victor Dolores-Calzadilla; Weiming Yao; Tjibbe de Vries; Kevin Williams

doi:10.1109/ICTON.2019.8840269

RF interconnects for high-speed and dense photonic integrated circuits

Photonic Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

We present the development of low loss radio-frequency interconnects for a generic InP photonic integrated platform. The proposed interconnects add a degree of freedom for the routing of RF signals, thereby enabling both high speed and denser photonic integrated circuits (PICs). As the proposed fabrication is carried out by post-processing, it can be integrated in a flexible way within the manufacturing process of PICs.

Original language	English
Title of host publication	21st International Conference on Transparent Optical Networks, ICTON 2019
Place of Publication	Piscataway
Publisher	IEEE Computer Society
Number of pages	4
ISBN (Electronic)	978-1-7281-2779-8
DOIs	https://doi.org/10.1109/ICTON.2019.8840269
Publication status	Published - 1 Jul 2019
Event	21st International Conference on Transparent Optical Networks (ICTON 2019) - Angers, France Duration: 9 Jul 2019 → 13 Jul 2019 http://www.icton2019.com/index.php

Conference

Conference	21st International Conference on Transparent Optical Networks (ICTON 2019)
Abbreviated title	ICTON2019
Country/Territory	France
City	Angers
Period	9/07/19 → 13/07/19
Internet address	http://www.icton2019.com/index.php

Funding

We acknowledge the Dutch Stimulus OPZuid programme through the Open Innovation Photonic ICs project (PROJ-00315) for supporting this work.

Keywords

Open innovation
Photonic integrated circuits
Photonic integration

Access to Document

10.1109/ICTON.2019.8840269

Cite this

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title = "RF interconnects for high-speed and dense photonic integrated circuits",

abstract = "We present the development of low loss radio-frequency interconnects for a generic InP photonic integrated platform. The proposed interconnects add a degree of freedom for the routing of RF signals, thereby enabling both high speed and denser photonic integrated circuits (PICs). As the proposed fabrication is carried out by post-processing, it can be integrated in a flexible way within the manufacturing process of PICs.",

keywords = "Open innovation, Photonic integrated circuits, Photonic integration",

author = "Victor Dolores-Calzadilla and Weiming Yao and \{de Vries\}, Tjibbe and Kevin Williams",

year = "2019",

month = jul,

day = "1",

doi = "10.1109/ICTON.2019.8840269",

language = "English",

booktitle = "21st International Conference on Transparent Optical Networks, ICTON 2019",

publisher = "IEEE Computer Society",

address = "United States",

note = "21st International Conference on Transparent Optical Networks (ICTON 2019), ICTON2019 ; Conference date: 09-07-2019 Through 13-07-2019",

url = "http://www.icton2019.com/index.php",

}

Dolores-Calzadilla, V , Yao, W, de Vries, T & Williams, K 2019, RF interconnects for high-speed and dense photonic integrated circuits. in 21st International Conference on Transparent Optical Networks, ICTON 2019., Sa.A5.2 , IEEE Computer Society, Piscataway, 21st International Conference on Transparent Optical Networks (ICTON 2019), Angers, France, 9/07/19. https://doi.org/10.1109/ICTON.2019.8840269

RF interconnects for high-speed and dense photonic integrated circuits. / Dolores-Calzadilla, Victor ; Yao, Weiming; de Vries, Tjibbe et al.
21st International Conference on Transparent Optical Networks, ICTON 2019. Piscataway: IEEE Computer Society, 2019. Sa.A5.2 .

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

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N2 - We present the development of low loss radio-frequency interconnects for a generic InP photonic integrated platform. The proposed interconnects add a degree of freedom for the routing of RF signals, thereby enabling both high speed and denser photonic integrated circuits (PICs). As the proposed fabrication is carried out by post-processing, it can be integrated in a flexible way within the manufacturing process of PICs.

AB - We present the development of low loss radio-frequency interconnects for a generic InP photonic integrated platform. The proposed interconnects add a degree of freedom for the routing of RF signals, thereby enabling both high speed and denser photonic integrated circuits (PICs). As the proposed fabrication is carried out by post-processing, it can be integrated in a flexible way within the manufacturing process of PICs.

KW - Open innovation

KW - Photonic integrated circuits

KW - Photonic integration

UR - https://www.scopus.com/pages/publications/85073048541

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M3 - Conference contribution

AN - SCOPUS:85073048541

BT - 21st International Conference on Transparent Optical Networks, ICTON 2019

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CY - Piscataway

T2 - 21st International Conference on Transparent Optical Networks (ICTON 2019)

Y2 - 9 July 2019 through 13 July 2019

ER -

RF interconnects for high-speed and dense photonic integrated circuits

Abstract

Conference

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Keywords

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