RF interconnects for high-speed and dense photonic integrated circuits

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Abstract

We present the development of low loss radio-frequency interconnects for a generic InP photonic integrated platform. The proposed interconnects add a degree of freedom for the routing of RF signals, thereby enabling both high speed and denser photonic integrated circuits (PICs). As the proposed fabrication is carried out by post-processing, it can be integrated in a flexible way within the manufacturing process of PICs.

Original languageEnglish
Title of host publication21st International Conference on Transparent Optical Networks, ICTON 2019
Place of PublicationPiscataway
PublisherIEEE Computer Society
Number of pages4
ISBN (Electronic)978-1-7281-2779-8
DOIs
Publication statusPublished - 1 Jul 2019
Event21st International Conference on Transparent Optical Networks, ICTON 2019 - Angers, France
Duration: 9 Jul 201913 Jul 2019
http://www.icton2019.com/index.php

Conference

Conference21st International Conference on Transparent Optical Networks, ICTON 2019
Abbreviated titleICTON2019
CountryFrance
CityAngers
Period9/07/1913/07/19
Internet address

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Keywords

  • Open innovation
  • Photonic integrated circuits
  • Photonic integration

Cite this

Dolores-Calzadilla, V., Yao, W., de Vries, T., & Williams, K. (2019). RF interconnects for high-speed and dense photonic integrated circuits. In 21st International Conference on Transparent Optical Networks, ICTON 2019 [Sa.A5.2 ] Piscataway: IEEE Computer Society. https://doi.org/10.1109/ICTON.2019.8840269