Residual stresses in microelectronics induced by thermoset packaging materials during cure

M.H.H. Meuwissen; H.A. Boer, de; H.L.A.H. Steijvers; P.J.G. Schreurs; M.G.D. Geers

Residual stresses in microelectronics induced by thermoset packaging materials during cure

M.H.H. Meuwissen
, H.A. Boer, de
, H.L.A.H. Steijvers
, P.J.G. Schreurs
, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the 3rd international conference on benefiting from thermal and mechanical simulation in (micro-)electronics, ESIME 2002 : 15-17 April 2002, Paris, France
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	332-339
ISBN (Print)	0-7803-9819-X
Publication status	Published - 2002

Cite this

Meuwissen, M. H. H., Boer, de, H. A., Steijvers, H. L. A. H., Schreurs, P. J. G., & Geers, M. G. D. (2002). Residual stresses in microelectronics induced by thermoset packaging materials during cure. In Proceedings of the 3rd international conference on benefiting from thermal and mechanical simulation in (micro-)electronics, ESIME 2002 : 15-17 April 2002, Paris, France (pp. 332-339). Institute of Electrical and Electronics Engineers.

Meuwissen, M.H.H. ; Boer, de, H.A. ; Steijvers, H.L.A.H. et al. / Residual stresses in microelectronics induced by thermoset packaging materials during cure. Proceedings of the 3rd international conference on benefiting from thermal and mechanical simulation in (micro-)electronics, ESIME 2002 : 15-17 April 2002, Paris, France. Piscataway : Institute of Electrical and Electronics Engineers, 2002. pp. 332-339

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title = "Residual stresses in microelectronics induced by thermoset packaging materials during cure",

author = "M.H.H. Meuwissen and \{Boer, de\}, H.A. and H.L.A.H. Steijvers and P.J.G. Schreurs and M.G.D. Geers",

year = "2002",

language = "English",

isbn = "0-7803-9819-X",

pages = "332--339",

booktitle = "Proceedings of the 3rd international conference on benefiting from thermal and mechanical simulation in (micro-)electronics, ESIME 2002 : 15-17 April 2002, Paris, France",

publisher = "Institute of Electrical and Electronics Engineers",

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Meuwissen, MHH, Boer, de, HA, Steijvers, HLAH, Schreurs, PJG & Geers, MGD 2002, Residual stresses in microelectronics induced by thermoset packaging materials during cure. in Proceedings of the 3rd international conference on benefiting from thermal and mechanical simulation in (micro-)electronics, ESIME 2002 : 15-17 April 2002, Paris, France. Institute of Electrical and Electronics Engineers, Piscataway, pp. 332-339.

Residual stresses in microelectronics induced by thermoset packaging materials during cure. / Meuwissen, M.H.H.; Boer, de, H.A.; Steijvers, H.L.A.H. et al.
Proceedings of the 3rd international conference on benefiting from thermal and mechanical simulation in (micro-)electronics, ESIME 2002 : 15-17 April 2002, Paris, France. Piscataway: Institute of Electrical and Electronics Engineers, 2002. p. 332-339.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Residual stresses in microelectronics induced by thermoset packaging materials during cure

AU - Meuwissen, M.H.H.

AU - Boer, de, H.A.

AU - Steijvers, H.L.A.H.

AU - Schreurs, P.J.G.

AU - Geers, M.G.D.

PY - 2002

Y1 - 2002

M3 - Conference contribution

SN - 0-7803-9819-X

SP - 332

EP - 339

BT - Proceedings of the 3rd international conference on benefiting from thermal and mechanical simulation in (micro-)electronics, ESIME 2002 : 15-17 April 2002, Paris, France

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Meuwissen MHH, Boer, de HA, Steijvers HLAH, Schreurs PJG, Geers MGD. Residual stresses in microelectronics induced by thermoset packaging materials during cure. In Proceedings of the 3rd international conference on benefiting from thermal and mechanical simulation in (micro-)electronics, ESIME 2002 : 15-17 April 2002, Paris, France. Piscataway: Institute of Electrical and Electronics Engineers. 2002. p. 332-339