Residual stresses in microelectronics induced by thermoset packaging materials during cure

M.H.H. Meuwissen, H.A. Boer, de, H.L.A.H. Steijvers, P.J.G. Schreurs, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageEnglish
Title of host publicationProceedings of the 3rd international conference on benefiting from thermal and mechanical simulation in (micro-)electronics, ESIME 2002 : 15-17 April 2002, Paris, France
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Print)0-7803-9819-X
Publication statusPublished - 2002

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