Residual stresses in microelectronics induced by thermoset packaging materials during cure

M.H.H. Meuwissen; H.A. Boer, de; H.L.A.H. Steijvers; P.J.G. Schreurs; M.G.D. Geers

doi:10.1016/j.microrel.2004.05.001

Residual stresses in microelectronics induced by thermoset packaging materials during cure

M.H.H. Meuwissen, H.A. Boer, de, H.L.A.H. Steijvers, P.J.G. Schreurs, M.G.D. Geers

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Abstract

This paper presents a constitutive model for predicting the stresses in thermosetting resins during cure. An overview is given of the experimental techniques used for determining the parameters in this model. The model is validated by comparing its predictions to additional measurements, which have not been used for the actual parameter estimation. This validation showed that the model is capable of giving fair predictions of the measured stresses. The model is implemented in a commercially available finite element package and its use is demonstrated by applying it to the study of a flip-chip underfilling process.

Original language	English
Pages (from-to)	1985-1994
Journal	Microelectronics Reliability
Volume	44
Issue number	12
DOIs	https://doi.org/10.1016/j.microrel.2004.05.001
Publication status	Published - 2004

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10.1016/j.microrel.2004.05.001

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title = "Residual stresses in microelectronics induced by thermoset packaging materials during cure",

abstract = "This paper presents a constitutive model for predicting the stresses in thermosetting resins during cure. An overview is given of the experimental techniques used for determining the parameters in this model. The model is validated by comparing its predictions to additional measurements, which have not been used for the actual parameter estimation. This validation showed that the model is capable of giving fair predictions of the measured stresses. The model is implemented in a commercially available finite element package and its use is demonstrated by applying it to the study of a flip-chip underfilling process.",

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AU - Meuwissen, M.H.H.

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AU - Schreurs, P.J.G.

AU - Geers, M.G.D.

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N2 - This paper presents a constitutive model for predicting the stresses in thermosetting resins during cure. An overview is given of the experimental techniques used for determining the parameters in this model. The model is validated by comparing its predictions to additional measurements, which have not been used for the actual parameter estimation. This validation showed that the model is capable of giving fair predictions of the measured stresses. The model is implemented in a commercially available finite element package and its use is demonstrated by applying it to the study of a flip-chip underfilling process.

AB - This paper presents a constitutive model for predicting the stresses in thermosetting resins during cure. An overview is given of the experimental techniques used for determining the parameters in this model. The model is validated by comparing its predictions to additional measurements, which have not been used for the actual parameter estimation. This validation showed that the model is capable of giving fair predictions of the measured stresses. The model is implemented in a commercially available finite element package and its use is demonstrated by applying it to the study of a flip-chip underfilling process.

U2 - 10.1016/j.microrel.2004.05.001

DO - 10.1016/j.microrel.2004.05.001

M3 - Article

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VL - 44

SP - 1985

EP - 1994

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 12

ER -

Residual stresses in microelectronics induced by thermoset packaging materials during cure

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