Residual stresses in microelectronics induced by thermoset packaging materials during cure

M.H.H. Meuwissen, H.A. Boer, de, H.L.A.H. Steijvers, P.J.G. Schreurs, M.G.D. Geers

Research output: Contribution to journalArticleAcademicpeer-review

21 Citations (Scopus)
3 Downloads (Pure)

Abstract

This paper presents a constitutive model for predicting the stresses in thermosetting resins during cure. An overview is given of the experimental techniques used for determining the parameters in this model. The model is validated by comparing its predictions to additional measurements, which have not been used for the actual parameter estimation. This validation showed that the model is capable of giving fair predictions of the measured stresses. The model is implemented in a commercially available finite element package and its use is demonstrated by applying it to the study of a flip-chip underfilling process.
Original languageEnglish
Pages (from-to)1985-1994
JournalMicroelectronics and Reliability : an International Journal and World Abstracting Service
Volume44
Issue number12
DOIs
Publication statusPublished - 2004

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