Abstract
Light-emitting diode (LED) technology has been rapidly developing due to high energy efficiency and longer lifetimes of LED luminaires. One of the main challenges in designing LED components is to manage the inter-twined relation between thermal, electrical, and optical performances. These dependencies are required to be well understood in order to operate LEDs efficiently and have accurate performance prediction at different levels of the product value chain. Delphi4LED project aims at developing standardised method to create multi-domain (thermal, electrical, and optical) compact models from the measurement data. To obtain highly reliable and representative data sets via characterisation and calibration, end-user requirements specification for diverse LED samples are needed. In this paper, we report the lists of LED parameters and components selected for measurements, simulation and calibration considering end-user needs. We also show some of the methodologies for compact thermal model development that are recommended in Delphi4LED, followed by definition of simulation benchmark problems.
Original language | English |
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Title of host publication | 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Number of pages | 8 |
ISBN (Electronic) | 978-1-5090-4344-6 |
ISBN (Print) | 978-1-5090-4345-3 |
DOIs | |
Publication status | Published - 10 May 2017 |
Event | 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 - Dresden, Germany Duration: 3 Apr 2017 → 5 Apr 2017 |
Conference
Conference | 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 |
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Country/Territory | Germany |
City | Dresden |
Period | 3/04/17 → 5/04/17 |
Keywords
- Light emitting diodes, Lighting, Electronic packaging thermal management, Temperature measurement, Thermal resistance, Reliability