Requirements specification for multi-domain LED compact model development in Delphi4LED

A. Alexeev, R. Bornoff, S. Lungten, G. Martin, G. Onushkin, A. Poppe, M. Rencz, J. Yu

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

12 Citations (Scopus)
17 Downloads (Pure)

Abstract

Light-emitting diode (LED) technology has been rapidly developing due to high energy efficiency and longer lifetimes of LED luminaires. One of the main challenges in designing LED components is to manage the inter-twined relation between thermal, electrical, and optical performances. These dependencies are required to be well understood in order to operate LEDs efficiently and have accurate performance prediction at different levels of the product value chain. Delphi4LED project aims at developing standardised method to create multi-domain (thermal, electrical, and optical) compact models from the measurement data. To obtain highly reliable and representative data sets via characterisation and calibration, end-user requirements specification for diverse LED samples are needed. In this paper, we report the lists of LED parameters and components selected for measurements, simulation and calibration considering end-user needs. We also show some of the methodologies for compact thermal model development that are recommended in Delphi4LED, followed by definition of simulation benchmark problems.

Original languageEnglish
Title of host publication2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Number of pages8
ISBN (Electronic)978-1-5090-4344-6
ISBN (Print)978-1-5090-4345-3
DOIs
Publication statusPublished - 10 May 2017
Event18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 - Dresden, Germany
Duration: 3 Apr 20175 Apr 2017

Conference

Conference18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
Country/TerritoryGermany
CityDresden
Period3/04/175/04/17

Keywords

  • Light emitting diodes, Lighting, Electronic packaging thermal management, Temperature measurement, Thermal resistance, Reliability

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