| Original language | English |
|---|---|
| Title of host publication | Proceedings of EuroSIME 2005 |
| Place of Publication | Germany, Berlin |
| Pages | 656- |
| Publication status | Published - 2005 |
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Reliability of SnAgCu solder balls in packaging
- M.E. Erinc
- , P.J.G. Schreurs
- , G.Q. Zhang
- , M.G.D. Geers
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review