Reliability of SnAgCu solder balls in packaging

M.E. Erinc, P.J.G. Schreurs, G.Q. Zhang, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationProceedings of EuroSIME 2005
Place of PublicationGermany, Berlin
Pages656-
Publication statusPublished - 2005

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