| Original language | English |
|---|---|
| Title of host publication | Proceedings of EuroSIME 2005 |
| Place of Publication | Germany, Berlin |
| Pages | 656- |
| Publication status | Published - 2005 |
Reliability of SnAgCu solder balls in packaging
M.E. Erinc, P.J.G. Schreurs, G.Q. Zhang, M.G.D. Geers
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review