Abstract
Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball these components with SnPb balls. The reliability of Lead-Free and Lead-Containing solder joints for BGA's has been investigated after re-balling using optimal microscopy. The goal was to compare the quality of the connections for both options. For the lead-free BGA, voids produced by the release of volatile species in flux during soldering were present. Large voids have been observed at the interface component/solder. Using components that were re-balled did not show the amount of voiding observed for the lead-free BGA. Kirkendall voiding has been observed for the lead-free component at the component/solder interface. It has been therefore concluded that the use of the reballed components is to be preferred to adjusting the reflow profile and using lead-free components
| Original language | English |
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| Title of host publication | IPC APEX Expo 2012, 28 Februari - 1 March 2012, San Diego, California, USA |
| Place of Publication | San Diego |
| Pages | 2019-2022 |
| Volume | 3 |
| Publication status | Published - 2012 |
| Event | conference; IPC APEX Expo 2012; 2012-02-28; 2012-03-01 - Duration: 28 Feb 2012 → 1 Mar 2012 |
Conference
| Conference | conference; IPC APEX Expo 2012; 2012-02-28; 2012-03-01 |
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| Period | 28/02/12 → 1/03/12 |
| Other | IPC APEX Expo 2012 |