Reliability issue of solder joints in microelectronics due to evolution of microstructure

M.A. Matin, W.P. Vellinga, M.G.D. Geers

Research output: Contribution to conferencePoster

71 Downloads (Pure)
Original languageEnglish
Publication statusPublished - 2001
EventMate Poster Award 2001 : 6th Annual Poster Contest -
Duration: 1 Jan 2001 → …

Conference

ConferenceMate Poster Award 2001 : 6th Annual Poster Contest
Period1/01/01 → …
OtherMate Poster Award 2001 : 6th Annual Poster Contest

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