Relation between light trapping and surface topography of plasma textured crystalline silicon wafers

F.M.M. Souren, J. Rentsch, M.C.M. Sanden, van de

Research output: Contribution to journalArticleAcademicpeer-review

9 Citations (Scopus)
188 Downloads (Pure)

Abstract

Currently, in the photovoltaic industry, wet chemical etching technologies are used for saw damage removal and surface texturing. Alternative to wet chemical etching is plasma etching. However, as for example, the linear microwave plasma technique, developed by Roth&Rau, has not been implemented in the photovoltaic industry for etching, because of the very low etch rate (
Original languageEnglish
Pages (from-to)352-366
JournalProgress in Photovoltaics: Research and Applications
Volume23
Issue number3
DOIs
Publication statusPublished - 2015

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