TY - JOUR
T1 - Relation between light trapping and surface topography of plasma textured crystalline silicon wafers
AU - Souren, F.M.M.
AU - Rentsch, J.
AU - Sanden, van de, M.C.M.
PY - 2015
Y1 - 2015
N2 - Currently, in the photovoltaic industry, wet chemical etching technologies are used for saw damage removal and surface texturing. Alternative to wet chemical etching is plasma etching. However, as for example, the linear microwave plasma technique, developed by Roth&Rau, has not been implemented in the photovoltaic industry for etching, because of the very low etch rate (
AB - Currently, in the photovoltaic industry, wet chemical etching technologies are used for saw damage removal and surface texturing. Alternative to wet chemical etching is plasma etching. However, as for example, the linear microwave plasma technique, developed by Roth&Rau, has not been implemented in the photovoltaic industry for etching, because of the very low etch rate (
U2 - 10.1002/pip.2439
DO - 10.1002/pip.2439
M3 - Article
SN - 1062-7995
VL - 23
SP - 352
EP - 366
JO - Progress in Photovoltaics: Research and Applications
JF - Progress in Photovoltaics: Research and Applications
IS - 3
ER -
