Abstract
From investigations on the SiH3 and SiH radical density and the surface reaction probability in a remote Ar-H2-SiH4 plasma, it is unambiguously demonstrated that the a-Si:H film quality improves significantly with increasing contribution of SiH3 and decreasing contribution of very reactive (poly)silane radicals. Device quality a-Si:H is obtained at deposition rates up to 100 Å/s for conditions where film growth is governed by SiH3 (contribution ∼90%) and where SiH has only a minor contribution (∼2%). Furthermore, for SiH3 dominated film growth the effect of the deposition rate on the a-Si:H film properties with respect to the substrate temperature is discussed.
| Original language | English |
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| Title of host publication | Amorphous and heterogeneous silicon thin films 2000 : symposium held [at the 2000 MRS Spring Meeting,] April 24 - 28, 2000, San Francisco, California, U.S.A |
| Editors | R.W. Collins |
| Place of Publication | Warrendale, PA, USA |
| Publisher | Materials Research Society |
| Pages | A4.2-1/6 |
| ISBN (Print) | 1-558-99517-X |
| DOIs | |
| Publication status | Published - 1 Dec 2000 |
| Event | Amorphous and Heterogeneus Silicon Thin Films-2000 - San Francisco, CA, United States Duration: 24 Apr 2000 → 28 Apr 2000 |
Publication series
| Name | Materials Research Society Symposium Proceedings |
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| Volume | 609 |
| ISSN (Print) | 0272-9172 |
Conference
| Conference | Amorphous and Heterogeneus Silicon Thin Films-2000 |
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| Country/Territory | United States |
| City | San Francisco, CA |
| Period | 24/04/00 → 28/04/00 |
Funding
B.A. Korevaar, C. Smit, and E.A.G. Hamers are gratefully acknowledged for their contribution to the measurements. This work has been financially supported by NWO, NOVEM and FOM.