Reduction of thermal cycling to increase the lifetime of MOSFET motor drives

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Abstract

The variation of the temperature in semiconductors, caused by the load profile, results in the long term in material fatigue. A distinction can be made between the average temperature and the temperature swing, where the temperature swing has a significant effect on the lifetime of a semiconductor. Therefore, the auxiliary-pole topology is proposed to reduce the temperature swing of the MOSFETs in a motor drive. The auxiliary-pole topology divides the load current over two switching-legs and circulates a current when there is a low or zero load current. The conventional half bridge topology is used as a benchmark. Both topologies are simulated with the same load profile and with an equal total amount of silicon. The results show a reduction of the temperature swing and an increase in average temperature of the switches in the auxiliary-pole topology. This leads to an significant improvement in cycles to failure and time to failure. Index Terms—Thermal management of electronics, Thermal management, Thermal stresses, Power semiconductor switches, Lifetime estimation, Motor drives
Original languageEnglish
Title of host publicationProceedings of the 40th Annual Conference of the IEEE Industrial Electronics Society (IECON 2014), October 29 - Novermber 1, 2014, Dallas, USA
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages1740-1746
Number of pages7
ISBN (Print)978-1-4799-4033-2
DOIs
Publication statusPublished - 2014
Event40th Annual Conference of the IEEE Industrial Electronics Society (IECON 2014) - Sheraton Dallas Hotel, Dallas, United States
Duration: 29 Oct 20141 Nov 2014
Conference number: 2014

Conference

Conference40th Annual Conference of the IEEE Industrial Electronics Society (IECON 2014)
Abbreviated titleIECON 2014
CountryUnited States
CityDallas
Period29/10/141/11/14

Keywords

  • Lifetime estimation
  • Motor drives
  • Power semiconductor switches
  • Thermal management
  • Thermal management of
  • Thermal stresses

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