Reduction of thermal cycling to increase the lifetime of MOSFET motor drives

N.H. Baars; C.G.E. Wijnands; J.L. Duarte

doi:10.1109/IECON.2014.7048737

Reduction of thermal cycling to increase the lifetime of MOSFET motor drives

N.H. Baars, C.G.E. Wijnands, J.L. Duarte

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

4 Citations (Scopus)

15 Downloads (Pure)

Abstract

The variation of the temperature in semiconductors, caused by the load profile, results in the long term in material fatigue. A distinction can be made between the average temperature and the temperature swing, where the temperature swing has a significant effect on the lifetime of a semiconductor. Therefore, the auxiliary-pole topology is proposed to reduce the temperature swing of the MOSFETs in a motor drive. The auxiliary-pole topology divides the load current over two switching-legs and circulates a current when there is a low or zero load current. The conventional half bridge topology is used as a benchmark. Both topologies are simulated with the same load profile and with an equal total amount of silicon. The results show a reduction of the temperature swing and an increase in average temperature of the switches in the auxiliary-pole topology. This leads to an significant improvement in cycles to failure and time to failure. Index Terms—Thermal management of electronics, Thermal management, Thermal stresses, Power semiconductor switches, Lifetime estimation, Motor drives

Original language	English
Title of host publication	Proceedings of the 40th Annual Conference of the IEEE Industrial Electronics Society (IECON 2014), October 29 - Novermber 1, 2014, Dallas, USA
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	1740-1746
Number of pages	7
ISBN (Print)	978-1-4799-4033-2
DOIs	https://doi.org/10.1109/IECON.2014.7048737
Publication status	Published - 2014
Event	40th Annual Conference of the IEEE Industrial Electronics Society, IECON 2014 - Sheraton Dallas Hotel, Dallas, United States Duration: 29 Oct 2014 → 1 Nov 2014 Conference number: 40

Conference

Conference	40th Annual Conference of the IEEE Industrial Electronics Society, IECON 2014
Abbreviated title	IECON 2014
Country/Territory	United States
City	Dallas
Period	29/10/14 → 1/11/14

Keywords

Lifetime estimation
Motor drives
Power semiconductor switches
Thermal management
Thermal management of
Thermal stresses

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10.1109/IECON.2014.7048737

Cite this

Baars, N. H., Wijnands, C. G. E., & Duarte, J. L. (2014). Reduction of thermal cycling to increase the lifetime of MOSFET motor drives. In Proceedings of the 40th Annual Conference of the IEEE Industrial Electronics Society (IECON 2014), October 29 - Novermber 1, 2014, Dallas, USA (pp. 1740-1746). Article 7048737 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/IECON.2014.7048737

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abstract = "The variation of the temperature in semiconductors, caused by the load profile, results in the long term in material fatigue. A distinction can be made between the average temperature and the temperature swing, where the temperature swing has a significant effect on the lifetime of a semiconductor. Therefore, the auxiliary-pole topology is proposed to reduce the temperature swing of the MOSFETs in a motor drive. The auxiliary-pole topology divides the load current over two switching-legs and circulates a current when there is a low or zero load current. The conventional half bridge topology is used as a benchmark. Both topologies are simulated with the same load profile and with an equal total amount of silicon. The results show a reduction of the temperature swing and an increase in average temperature of the switches in the auxiliary-pole topology. This leads to an significant improvement in cycles to failure and time to failure. Index Terms—Thermal management of electronics, Thermal management, Thermal stresses, Power semiconductor switches, Lifetime estimation, Motor drives",

keywords = "Lifetime estimation, Motor drives, Power semiconductor switches, Thermal management, Thermal management of , Thermal stresses",

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Baars, NH , Wijnands, CGE & Duarte, JL 2014, Reduction of thermal cycling to increase the lifetime of MOSFET motor drives. in Proceedings of the 40th Annual Conference of the IEEE Industrial Electronics Society (IECON 2014), October 29 - Novermber 1, 2014, Dallas, USA., 7048737, Institute of Electrical and Electronics Engineers, Piscataway, pp. 1740-1746, 40th Annual Conference of the IEEE Industrial Electronics Society, IECON 2014, Dallas, Texas, United States, 29/10/14. https://doi.org/10.1109/IECON.2014.7048737

Reduction of thermal cycling to increase the lifetime of MOSFET motor drives. / Baars, N.H.; Wijnands, C.G.E.; Duarte, J.L.
Proceedings of the 40th Annual Conference of the IEEE Industrial Electronics Society (IECON 2014), October 29 - Novermber 1, 2014, Dallas, USA. Piscataway: Institute of Electrical and Electronics Engineers, 2014. p. 1740-1746 7048737.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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N2 - The variation of the temperature in semiconductors, caused by the load profile, results in the long term in material fatigue. A distinction can be made between the average temperature and the temperature swing, where the temperature swing has a significant effect on the lifetime of a semiconductor. Therefore, the auxiliary-pole topology is proposed to reduce the temperature swing of the MOSFETs in a motor drive. The auxiliary-pole topology divides the load current over two switching-legs and circulates a current when there is a low or zero load current. The conventional half bridge topology is used as a benchmark. Both topologies are simulated with the same load profile and with an equal total amount of silicon. The results show a reduction of the temperature swing and an increase in average temperature of the switches in the auxiliary-pole topology. This leads to an significant improvement in cycles to failure and time to failure. Index Terms—Thermal management of electronics, Thermal management, Thermal stresses, Power semiconductor switches, Lifetime estimation, Motor drives

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BT - Proceedings of the 40th Annual Conference of the IEEE Industrial Electronics Society (IECON 2014), October 29 - Novermber 1, 2014, Dallas, USA

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Baars NH , Wijnands CGE , Duarte JL. Reduction of thermal cycling to increase the lifetime of MOSFET motor drives. In Proceedings of the 40th Annual Conference of the IEEE Industrial Electronics Society (IECON 2014), October 29 - Novermber 1, 2014, Dallas, USA. Piscataway: Institute of Electrical and Electronics Engineers. 2014. p. 1740-1746. 7048737 doi: 10.1109/IECON.2014.7048737

Reduction of thermal cycling to increase the lifetime of MOSFET motor drives

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