Realisation of a phased-array multiwavelength laser using hybridly integrated PICs

D. Thourhout, Van, A. Hove, van, T. Caenegem, van, K. Vandeputte, P. Vandaele, I. Moerman, X.J.M. Leijtens, M.K. Smit, R.G.F. Baets

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)

Abstract

We developed a hybrid integration technology only employing InP components and realised a multi-wavelength laser using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3-dB bandwidth and a linewidth below 1 MHz were measured.
Original languageEnglish
Title of host publicationProceedings of the 50th Electronic Components & Technology Conference (ECTC 2000) May 21-24, 2000, Las Vegas, Nevada, USA
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages1266-1271
ISBN (Print)0-7803-5908-9
DOIs
Publication statusPublished - 2000
Event50th Electronic Components and technology conference, (ECTC2000), May 21-24, 2000, Las Vegas, Nevada, USA - Las Vegas, United States
Duration: 21 May 200024 May 2000
http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=853094

Conference

Conference50th Electronic Components and technology conference, (ECTC2000), May 21-24, 2000, Las Vegas, Nevada, USA
Abbreviated titleECTC2000
CountryUnited States
CityLas Vegas
Period21/05/0024/05/00
Internet address

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