Abstract
We developed a hybrid integration technology only employing InP components and realised a multi-wavelength laser using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3-dB bandwidth and a linewidth below 1 MHz were measured.
Original language | English |
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Title of host publication | Proceedings of the 50th Electronic Components & Technology Conference (ECTC 2000) May 21-24, 2000, Las Vegas, Nevada, USA |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 1266-1271 |
ISBN (Print) | 0-7803-5908-9 |
DOIs | |
Publication status | Published - 2000 |
Event | 50th Electronic Components and technology conference, (ECTC2000), May 21-24, 2000, Las Vegas, Nevada, USA - Las Vegas, United States Duration: 21 May 2000 → 24 May 2000 http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=853094 |
Conference
Conference | 50th Electronic Components and technology conference, (ECTC2000), May 21-24, 2000, Las Vegas, Nevada, USA |
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Abbreviated title | ECTC2000 |
Country/Territory | United States |
City | Las Vegas |
Period | 21/05/00 → 24/05/00 |
Internet address |