Re-use of components and sub-assemblies for product end-of-life management through functional signature analysis

G. Hulsken, J.A. Bogaard, van den

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    Original languageEnglish
    Title of host publicationERA Conference Proceedings Recycling of Electrical and Electronic Equipment
    PublisherERA
    Pages17.1-17.8
    Publication statusPublished - 2003

    Cite this

    Hulsken, G., & Bogaard, van den, J. A. (2003). Re-use of components and sub-assemblies for product end-of-life management through functional signature analysis. In ERA Conference Proceedings Recycling of Electrical and Electronic Equipment (pp. 17.1-17.8). ERA.
    Hulsken, G. ; Bogaard, van den, J.A. / Re-use of components and sub-assemblies for product end-of-life management through functional signature analysis. ERA Conference Proceedings Recycling of Electrical and Electronic Equipment. ERA, 2003. pp. 17.1-17.8
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    title = "Re-use of components and sub-assemblies for product end-of-life management through functional signature analysis",
    author = "G. Hulsken and {Bogaard, van den}, J.A.",
    year = "2003",
    language = "English",
    pages = "17.1--17.8",
    booktitle = "ERA Conference Proceedings Recycling of Electrical and Electronic Equipment",
    publisher = "ERA",

    }

    Hulsken, G & Bogaard, van den, JA 2003, Re-use of components and sub-assemblies for product end-of-life management through functional signature analysis. in ERA Conference Proceedings Recycling of Electrical and Electronic Equipment. ERA, pp. 17.1-17.8.

    Re-use of components and sub-assemblies for product end-of-life management through functional signature analysis. / Hulsken, G.; Bogaard, van den, J.A.

    ERA Conference Proceedings Recycling of Electrical and Electronic Equipment. ERA, 2003. p. 17.1-17.8.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    TY - GEN

    T1 - Re-use of components and sub-assemblies for product end-of-life management through functional signature analysis

    AU - Hulsken, G.

    AU - Bogaard, van den, J.A.

    PY - 2003

    Y1 - 2003

    M3 - Conference contribution

    SP - 17.1-17.8

    BT - ERA Conference Proceedings Recycling of Electrical and Electronic Equipment

    PB - ERA

    ER -

    Hulsken G, Bogaard, van den JA. Re-use of components and sub-assemblies for product end-of-life management through functional signature analysis. In ERA Conference Proceedings Recycling of Electrical and Electronic Equipment. ERA. 2003. p. 17.1-17.8