Original language | English |
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Title of host publication | ERA Conference Proceedings Recycling of Electrical and Electronic Equipment |
Publisher | ERA |
Pages | 17.1-17.8 |
Publication status | Published - 2003 |
Re-use of components and sub-assemblies for product end-of-life management through functional signature analysis
G. Hulsken, J.A. Bogaard, van den
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic