Re-use of components and sub-assemblies for product end-of-life management through functional signature analysis

G. Hulsken, J.A. Bogaard, van den

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    Original languageEnglish
    Title of host publicationERA Conference Proceedings Recycling of Electrical and Electronic Equipment
    PublisherERA
    Pages17.1-17.8
    Publication statusPublished - 2003

    Cite this