Rapid thermal processing: status problems and options after the first 25 years

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Abstract

This paper reviews the current status,l problems and options in RTP systems and process design. Some commercial systems will be discussed along with some improvements that can still be made in temperature reproducibility, process control and yield. This includes some recent developments in temperature reproducibility by compensated emissivity control. Uniformity issues regarding temperature and process gas hydrodynamics are highlighted in relation to reactor design. Especially in CVD applications, where radiative heat transfer may not longer dominate convective and conductive heat transfer, modeling and visualization of gas flow patterns are becoming increasingly important. Here, reactor design should be such that a laminar flow regime is reached without turbulence and without chemical memory effects upon switching to other gas compositions. Some flow visualization results are illustrated. Some new options for micro- and nanocrystallization reactions are presented before we conclude with a technology roadmap to the 1-Gbit era.

Original languageEnglish
Title of host publicationRapid Thermal and Integrated Processing II
EditorsJeffrey C. Gelpey, Kiefer J. Elliott, Jimmie J. Wortman, Atul Ajmera
Place of PublicationWarrendale
PublisherMaterials Research Society
Pages149-164
Number of pages16
ISBN (Print)1558991999
Publication statusPublished - 1 Dec 1993
Externally publishedYes
Event1993 Materials Research Society Spring Meeting - San Francisco, CA, USA, United States
Duration: 12 Apr 199315 Apr 1993

Publication series

NameMaterials Research Society symposium proceedings
Volume303
ISSN (Print)0272-9172

Conference

Conference1993 Materials Research Society Spring Meeting
CountryUnited States
CitySan Francisco, CA, USA
Period12/04/9315/04/93

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  • Cite this

    Roozeboom, F. (1993). Rapid thermal processing: status problems and options after the first 25 years. In J. C. Gelpey, K. J. Elliott, J. J. Wortman, & A. Ajmera (Eds.), Rapid Thermal and Integrated Processing II (pp. 149-164). (Materials Research Society symposium proceedings; Vol. 303). Materials Research Society.