Quantitative microscopy of microstructure evolution in eutectic solders subjected to static thermal load

M.A. Matin; W.P. Vellinga; M.G.D. Geers

Quantitative microscopy of microstructure evolution in eutectic solders subjected to static thermal load

M.A. Matin, W.P. Vellinga, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the conference (EuroSimE 2003) 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003
Editors	L.J. Ernst
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	111-116
ISBN (Print)	0-7803-7056-2
Publication status	Published - 2003

Cite this

Matin, M. A., Vellinga, W. P., & Geers, M. G. D. (2003). Quantitative microscopy of microstructure evolution in eutectic solders subjected to static thermal load. In L. J. Ernst (Ed.), Proceedings of the conference (EuroSimE 2003) 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003 (pp. 111-116). Institute of Electrical and Electronics Engineers.

Matin, M.A. ; Vellinga, W.P. ; Geers, M.G.D. / Quantitative microscopy of microstructure evolution in eutectic solders subjected to static thermal load. Proceedings of the conference (EuroSimE 2003) 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003. editor / L.J. Ernst. Piscataway : Institute of Electrical and Electronics Engineers, 2003. pp. 111-116

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Matin, MA, Vellinga, WP & Geers, MGD 2003, Quantitative microscopy of microstructure evolution in eutectic solders subjected to static thermal load. in LJ Ernst (ed.), Proceedings of the conference (EuroSimE 2003) 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003. Institute of Electrical and Electronics Engineers, Piscataway, pp. 111-116.

Quantitative microscopy of microstructure evolution in eutectic solders subjected to static thermal load. / Matin, M.A.; Vellinga, W.P.; Geers, M.G.D.
Proceedings of the conference (EuroSimE 2003) 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003. ed. / L.J. Ernst. Piscataway: Institute of Electrical and Electronics Engineers, 2003. p. 111-116.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Quantitative microscopy of microstructure evolution in eutectic solders subjected to static thermal load

AU - Matin, M.A.

AU - Vellinga, W.P.

AU - Geers, M.G.D.

PY - 2003

Y1 - 2003

M3 - Conference contribution

SN - 0-7803-7056-2

SP - 111

EP - 116

BT - Proceedings of the conference (EuroSimE 2003) 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003

A2 - Ernst, L.J.

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

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Matin MA, Vellinga WP, Geers MGD. Quantitative microscopy of microstructure evolution in eutectic solders subjected to static thermal load. In Ernst LJ, editor, Proceedings of the conference (EuroSimE 2003) 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003. Piscataway: Institute of Electrical and Electronics Engineers. 2003. p. 111-116