Abstract
There is a variation in the characteristics of an LED partly due to variation in the manufacturing process and the sourcing of materials from differing vendors. From a thermal perspective these variations result in differing thermal characteristics such as R thJC (the thermal resistance between chip junction and case) and Z th (the thermal impedance curve). This study seeks to quantify the measured variation of a number of LED part samples and provide insight into the root cause of those variations. Such information would provide additional confidence to a lighting engineer when selecting LEDs, when modelling their thermal behaviour and thus modelling their thermally dependent optical performance.
Original language | English |
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Title of host publication | THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Number of pages | 6 |
ISBN (Electronic) | 9781538667590 |
DOIs | |
Publication status | Published - 27 Dec 2018 |
Event | 24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018 - Stockholm, Sweden Duration: 26 Sept 2018 → 28 Sept 2018 https://therminic2018.eu/ |
Conference
Conference | 24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018 |
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Abbreviated title | Therminic2018 |
Country/Territory | Sweden |
City | Stockholm |
Period | 26/09/18 → 28/09/18 |
Internet address |
Funding
The contribution of the European Union for supporting this work in the context of the H2020 ECSEL Joint Under-taking programme (2016-2019) within the frames of the Delphi4LED project (grant agreement 692465) is acknowledged. Cofinancing of the Delphi4LED project by the R&D funding organizations of the governments of the countries participating in this experiment through their national grant agreements is also acknowledged.
Keywords
- LED
- Structure Function
- Variation