Prospects for electronic photonic integration

K.A. Williams

doi:10.1364/IPRSN.2017.IW3A.1

Prospects for electronic photonic integration

K.A. Williams

Photonic Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.

Original language	English
Title of host publication	Advanced Photonics, IPRSN 2017
Place of Publication	S.l.
Publisher	Optical Society of America (OSA)
Number of pages	3
ISBN (Electronic)	978-1-943580-30-9
DOIs	https://doi.org/10.1364/IPRSN.2017.IW3A.1
Publication status	Published - 1 Jan 2017
Event	Advanced Photonics Congress 2017 - New Orleans, United States Duration: 24 Jul 2017 → 27 Jul 2017

Conference

Conference	Advanced Photonics Congress 2017
Country/Territory	United States
City	New Orleans
Period	24/07/17 → 27/07/17

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10.1364/IPRSN.2017.IW3A.1

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title = "Prospects for electronic photonic integration",

abstract = "As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.",

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year = "2017",

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AB - As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.

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M3 - Conference contribution

AN - SCOPUS:85028010179

BT - Advanced Photonics, IPRSN 2017

PB - Optical Society of America (OSA)

CY - S.l.

T2 - Advanced Photonics Congress 2017

Y2 - 24 July 2017 through 27 July 2017

ER -

Prospects for electronic photonic integration

Abstract

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