Prospects for electronic photonic integration

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As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.

Original languageEnglish
Title of host publicationAdvanced Photonics, IPRSN 2017
Place of PublicationS.l.
PublisherOptical Society of America (OSA)
Number of pages3
ISBN (Electronic)978-1-943580-30-9
Publication statusPublished - 1 Jan 2017
EventAdvanced Photonics Congress 2017 - New Orleans, United States
Duration: 24 Jul 201727 Jul 2017


ConferenceAdvanced Photonics Congress 2017
Country/TerritoryUnited States
CityNew Orleans


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