Indium Phosphide is a versatile semiconductor material that allows for integration of a broad range of components in a single chip. Basic building blocks include lasers, optical amplifiers, modulators, detectors and a variety of passive components, including wavelength demultiplexers, filters and couplers. InP-chips with record complexities of more than 1700 components integrated in a single chip have been reported. InP-based foundry processes offer low-cost access to mature integration processes with high performance and wafer-scale integration of InP-based photonic circuits with silicon electronics is emerging. Meint Smit will discuss what’s coming next and why this phase is important.
|Title of host publication||1st Photonic Integration Conference, 23 September 2015, Eindhoven, The Netherlands|
|Place of Publication||HTC Eindhoven|
|Publication status||Published - 2015|
|Event||1st Photonic Integration Conference - High Tech Campus Eindhoven, Eindhoven, Netherlands|
Duration: 23 Sep 2015 → 23 Sep 2015
|Conference||1st Photonic Integration Conference|
|Period||23/09/15 → 23/09/15|