Abstract
Indium Phosphide is a versatile semiconductor material that allows for integration of a broad range of components in a single chip. Basic building blocks include lasers, optical amplifiers, modulators, detectors and a variety of passive components, including wavelength demultiplexers, filters and couplers. InP-chips with record complexities of more than 1700 components integrated in a single chip have been reported. InP-based foundry processes offer low-cost access to mature integration processes with high performance and wafer-scale integration of InP-based photonic circuits with silicon electronics is emerging. Meint Smit will discuss what’s coming next and why this phase is important.
| Original language | English |
|---|---|
| Title of host publication | 1st Photonic Integration Conference, 23 September 2015, Eindhoven, The Netherlands |
| Place of Publication | HTC Eindhoven |
| Publication status | Published - 2015 |
| Event | 1st Photonic Integration Conference - High Tech Campus Eindhoven, Eindhoven, Netherlands Duration: 23 Sept 2015 → 23 Sept 2015 |
Conference
| Conference | 1st Photonic Integration Conference |
|---|---|
| Country/Territory | Netherlands |
| City | Eindhoven |
| Period | 23/09/15 → 23/09/15 |