Progress and prospects in nanoscale dry processes: How can we control atomic layer reactions?

K. Ishikawa, K. Karahashi, T. Ichiki, J.P. Chang, S.M. George, W.M.M. Kessels, H.J. Lee, S. Tinck, J.H. Um, K. Kinoshita

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Abstract

In this review, we discuss the progress of emerging dry processes for nanoscale fabrication. Experts in the fields of plasma processing have contributed to addressing the increasingly challenging demands in achieving atomic-level control of material selectivity and physicochemical reactions involving ion bombardment. The discussion encompasses major challenges shared across the plasma science and technology community. Focus is placed on advances in the development of fabrication technologies for emerging materials, especially metallic and intermetallic compounds and multiferroic, and two-dimensional (2D) materials, as well as state-of-the-art techniques used in nanoscale semiconductor manufacturing with a brief summary of future challenges.
Original languageEnglish
Article number06HA02
Number of pages13
JournalJapanese Journal of Applied Physics
Volume56
Issue number6S2
DOIs
Publication statusPublished - 1 Jun 2017

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