Abstract
The invention relates to a photo-embossing process for the preparation of a polymeric relief structure comprising the steps of: a) coating a substrate with a coating composition comprising one or more radiation-sensitive ingredients and less than 30 wt% polymeric binder material; b) locally treating the coated substrate with electromagnetic radiation having a periodic, non-periodic or random radiation-intensity pattern, forming a latent image, at a temperature below a transition temperature of the coating composition; and c) polymerizing and/or crosslinking the resulting coated substrate, at a temperature above said transition temperature, wherein the transition temperature is a temperature that defines a transition of the coating composition between a state of high viscosity and low viscosity and wherein the coating composition comprises a compound A comprising at least one radiation curable group and a photoinitiator, the coating composition having a transition temperature between 30 DEG C and 120 DEG C.
| Original language | English |
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| Patent number | WO2009124942 |
| Priority date | 7/04/08 |
| Publication status | Published - 17 Feb 2010 |