Process for preparing a polymeric relief structure

C.W.M. Bastiaansen (Inventor), D.J. Broer (Inventor), C. Sanchez (Inventor)

    Research output: PatentPatent publication

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    Abstract

    The present invention relates to a process for the preparation of a polymeric relief structure by a) coating a substrate with a first coating composition comprising one or more radiation-sensitive ingredients, d) locally treating the coated substrate with electromagnetic radiation having a periodic or random radiation-intensity pattern, forming a latent image, e) polymerizing and/or crosslinking the resulting coated substrate to a first coating. This process is improved by applying a second coating composition on top of the first coating composition, said second coating composition comprising either an organic compound (Co) of a monomeric nature and wherein Co is also polymerized during the process, or wherein said second coating comprises a dissolved polymer (Cp).; As a result a polymeric relief structure is obtained, where a substrate is coated with a functional, stacked, bi-layer, in which each layer exhibits a specific, and from eachother differing function.
    Original languageEnglish
    Patent numberWO2006085741
    Publication statusPublished - 17 Aug 2006

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