Preface: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5

F. Roozeboom, V. Narayanan, K. Kakushima, P.J. Timans, E.P. Gusev, Z. Karim, Stefan De Gendt

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Pages (from-to)	III-IV
Journal	ECS Transactions
Volume	66
Issue number	4
Publication status	Published - 24 May 2015
Event	227th Electrochemical Society Meeting (ECS 2015) - Chicago, IL, United States Duration: 24 May 2015 → 28 May 2015 Conference number: 227

Cite this

@article{8a0105ba96824cd7a41f7bd8de48aebf,

title = "Preface: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5 ",

author = "F. Roozeboom and V. Narayanan and K. Kakushima and P.J. Timans and E.P. Gusev and Z. Karim and {De Gendt}, Stefan",

year = "2015",

month = may,

day = "24",

language = "English",

volume = "66",

pages = "III--IV",

journal = "ECS Transactions",

issn = "1938-5862",

publisher = "Electrochemical Society, Inc.",

number = "4",

note = "227th Electrochemical Society Meeting (ECS 2015), ECS 2015 ; Conference date: 24-05-2015 Through 28-05-2015",

}

TY - JOUR

T1 - Preface

T2 - 227th Electrochemical Society Meeting (ECS 2015)

AU - Roozeboom, F.

AU - Narayanan, V.

AU - Kakushima, K.

AU - Timans, P.J.

AU - Gusev, E.P.

AU - Karim, Z.

AU - De Gendt, Stefan

N1 - Conference code: 227

PY - 2015/5/24

Y1 - 2015/5/24

UR - http://ecst.ecsdl.org/content/66/4

M3 - Editorial

SN - 1938-5862

VL - 66

SP - III-IV

JO - ECS Transactions

JF - ECS Transactions

IS - 4

Y2 - 24 May 2015 through 28 May 2015

ER -