Preface: Silicon compatible materials, processes, and technologies for advanced integrated circuits and emerging applications 6

F. Roozeboom, V. Narayanan, K. Kakushima, P.J. Timans, E.P. Gusev, Z. Karim, Stefan de Gendt

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Pages (from-to)	III-IV
Journal	ECS Transactions
Volume	72
Issue number	4
Publication status	Published - 2 Jun 2016
Event	229th Electrochemical Society Meeting (ECS 2016) - San Diego, United States Duration: 29 May 2018 → 3 Jun 2018 Conference number: 229 https://www.electrochem.org/229

Cite this

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title = "Preface: Silicon compatible materials, processes, and technologies for advanced integrated circuits and emerging applications 6 ",

author = "F. Roozeboom and V. Narayanan and K. Kakushima and P.J. Timans and E.P. Gusev and Z. Karim and {de Gendt}, Stefan",

year = "2016",

month = jun,

day = "2",

language = "English",

volume = "72",

pages = "III--IV",

journal = "ECS Transactions",

issn = "1938-5862",

publisher = "Electrochemical Society, Inc.",

number = "4",

note = "229th Electrochemical Society Meeting (ECS 2016), ECS 2016 ; Conference date: 29-05-2018 Through 03-06-2018",

url = "https://www.electrochem.org/229",

}

TY - JOUR

T1 - Preface

T2 - 229th Electrochemical Society Meeting (ECS 2016)

AU - Roozeboom, F.

AU - Narayanan, V.

AU - Kakushima, K.

AU - Timans, P.J.

AU - Gusev, E.P.

AU - Karim, Z.

AU - de Gendt, Stefan

N1 - Conference code: 229

PY - 2016/6/2

Y1 - 2016/6/2

UR - http://ecst.ecsdl.org/content/72/4

M3 - Editorial

SN - 1938-5862

VL - 72

SP - III-IV

JO - ECS Transactions

JF - ECS Transactions

IS - 4

Y2 - 29 May 2018 through 3 June 2018

ER -