Preface: Silicon compatible materials, processes, and technologies for advanced integrated circuits and emerging applications 7

F. Roozeboom; H. Jagannathan; K. Kakushima; P.J. Timans; E.P. Gusev; Z. Karim; S. de Gendt

Preface: Silicon compatible materials, processes, and technologies for advanced integrated circuits and emerging applications 7

F. Roozeboom, H. Jagannathan, K. Kakushima, P.J. Timans, E.P. Gusev, Z. Karim, S. de Gendt

Plasma & Materials Processing

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Pages (from-to)	iii-iv
Journal	ECS Transactions
Volume	77
Issue number	5
Publication status	Published - 1 Jan 2017
Event	International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7 - 231st ECS Meeting 2017 - New Orleans, United States Duration: 28 May 2017 → 1 Jun 2017

Cite this

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title = "Preface: Silicon compatible materials, processes, and technologies for advanced integrated circuits and emerging applications 7",

author = "F. Roozeboom and H. Jagannathan and K. Kakushima and P.J. Timans and E.P. Gusev and Z. Karim and {de Gendt}, S.",

year = "2017",

month = jan,

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volume = "77",

pages = "iii--iv",

journal = "ECS Transactions",

issn = "1938-6737",

publisher = "Electrochemical Society, Inc.",

number = "5",

note = "International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7 - 231st ECS Meeting 2017 ; Conference date: 28-05-2017 Through 01-06-2017",

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Preface : Silicon compatible materials, processes, and technologies for advanced integrated circuits and emerging applications 7. / Roozeboom, F.; Jagannathan, H.; Kakushima, K.; Timans, P.J.; Gusev, E.P.; Karim, Z.; de Gendt, S.

In: ECS Transactions, Vol. 77, No. 5, 01.01.2017, p. iii-iv.

Research output: Contribution to journal › Editorial › Academic › peer-review

TY - JOUR

T1 - Preface

T2 - International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7 - 231st ECS Meeting 2017

AU - Roozeboom, F.

AU - Jagannathan, H.

AU - Kakushima, K.

AU - Timans, P.J.

AU - Gusev, E.P.

AU - Karim, Z.

AU - de Gendt, S.

PY - 2017/1/1

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M3 - Editorial

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VL - 77

SP - iii-iv

JO - ECS Transactions

JF - ECS Transactions

SN - 1938-6737

IS - 5

Y2 - 28 May 2017 through 1 June 2017

ER -