Preface: Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9

F. Roozeboom, P.J. Timans, K. Kakushima, E.P. Gusev, Z. Karim, D. Misra, Y. Obeng, S. De Gendt, H. Jagannathan

Research output: Contribution to journalEditorialAcademicpeer-review

Original languageEnglish
Pages (from-to)III
Number of pages1
JournalECS Transactions
Volume89
Issue number3
Publication statusPublished - 1 Jan 2019
EventInternational Symposium on Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9 - 235th ECS Meeting - Dallas, United States
Duration: 26 May 201930 May 2019

Cite this

Roozeboom, F., Timans, P. J., Kakushima, K., Gusev, E. P., Karim, Z., Misra, D., ... Jagannathan, H. (2019). Preface: Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9. ECS Transactions, 89(3), III.
Roozeboom, F. ; Timans, P.J. ; Kakushima, K. ; Gusev, E.P. ; Karim, Z. ; Misra, D. ; Obeng, Y. ; De Gendt, S. ; Jagannathan, H. / Preface : Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9. In: ECS Transactions. 2019 ; Vol. 89, No. 3. pp. III.
@article{a7fff19a64b540659a62613dd14e9261,
title = "Preface: Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9",
author = "F. Roozeboom and P.J. Timans and K. Kakushima and E.P. Gusev and Z. Karim and D. Misra and Y. Obeng and {De Gendt}, S. and H. Jagannathan",
year = "2019",
month = "1",
day = "1",
language = "English",
volume = "89",
pages = "III",
journal = "ECS Transactions",
issn = "1938-6737",
publisher = "Electrochemical Society, Inc.",
number = "3",

}

Roozeboom, F, Timans, PJ, Kakushima, K, Gusev, EP, Karim, Z, Misra, D, Obeng, Y, De Gendt, S & Jagannathan, H 2019, 'Preface: Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9', ECS Transactions, vol. 89, no. 3, pp. III.

Preface : Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9. / Roozeboom, F.; Timans, P.J.; Kakushima, K.; Gusev, E.P.; Karim, Z.; Misra, D.; Obeng, Y.; De Gendt, S.; Jagannathan, H.

In: ECS Transactions, Vol. 89, No. 3, 01.01.2019, p. III.

Research output: Contribution to journalEditorialAcademicpeer-review

TY - JOUR

T1 - Preface

T2 - Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9

AU - Roozeboom, F.

AU - Timans, P.J.

AU - Kakushima, K.

AU - Gusev, E.P.

AU - Karim, Z.

AU - Misra, D.

AU - Obeng, Y.

AU - De Gendt, S.

AU - Jagannathan, H.

PY - 2019/1/1

Y1 - 2019/1/1

UR - http://www.scopus.com/inward/record.url?scp=85070094688&partnerID=8YFLogxK

M3 - Editorial

AN - SCOPUS:85070094688

VL - 89

SP - III

JO - ECS Transactions

JF - ECS Transactions

SN - 1938-6737

IS - 3

ER -