Preface: Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9

F. Roozeboom; P.J. Timans; K. Kakushima; E.P. Gusev; Z. Karim; D. Misra; Y. Obeng; S. De Gendt; H. Jagannathan

Preface: Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9

F. Roozeboom, P.J. Timans, K. Kakushima, E.P. Gusev, Z. Karim, D. Misra, Y. Obeng, S. De Gendt, H. Jagannathan

Plasma & Materials Processing

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Pages (from-to)	III
Number of pages	1
Journal	ECS Transactions
Volume	89
Issue number	3
Publication status	Published - 1 Jan 2019
Event	International Symposium on Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9 - 235th ECS Meeting - Dallas, United States Duration: 26 May 2019 → 30 May 2019

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title = "Preface: Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9",

author = "F. Roozeboom and P.J. Timans and K. Kakushima and E.P. Gusev and Z. Karim and D. Misra and Y. Obeng and {De Gendt}, S. and H. Jagannathan",

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TY - JOUR

T1 - Preface

T2 - International Symposium on Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9 - 235th ECS Meeting

AU - Roozeboom, F.

AU - Timans, P.J.

AU - Kakushima, K.

AU - Gusev, E.P.

AU - Karim, Z.

AU - Misra, D.

AU - Obeng, Y.

AU - De Gendt, S.

AU - Jagannathan, H.

PY - 2019/1/1

Y1 - 2019/1/1

UR - http://www.scopus.com/inward/record.url?scp=85070094688&partnerID=8YFLogxK

M3 - Editorial

AN - SCOPUS:85070094688

SN - 1938-5862

VL - 89

SP - III

JO - ECS Transactions

JF - ECS Transactions

IS - 3

Y2 - 26 May 2019 through 30 May 2019

ER -

Preface: Silicon compatible emerging materials, processes, and technologies for advanced CMOS and post-CMOS applications 9

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