Preface: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 4

K. Kondo, E. Podlaha-Murphy, G. S. Mathad, F. Roozeboom

Research output: Contribution to journalEditorialAcademicpeer-review

Original languageEnglish
Pages (from-to)III-IV
JournalECS Transactions
Issue number32
Publication statusPublished - 1 Jan 2013
EventPRiME 2012 - Honolulu, HI, United States
Duration: 7 Oct 201212 Oct 2017

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