Preface: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 4

K. Kondo, E. Podlaha-Murphy, G. S. Mathad, F. Roozeboom

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Pages (from-to)	III-IV
Journal	ECS Transactions
Volume	50
Issue number	32
Publication status	Published - 1 Jan 2013
Event	PRiME 2012 - Honolulu, HI, United States Duration: 7 Oct 2012 → 12 Oct 2017

Cite this

@article{b643fdb076d24512af9821c43bf8a850,

title = "Preface: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 4",

author = "K. Kondo and E. Podlaha-Murphy and Mathad, {G. S.} and F. Roozeboom",

year = "2013",

month = jan,

day = "1",

language = "English",

volume = "50",

pages = "III--IV",

journal = "ECS Transactions",

issn = "1938-5862",

publisher = "Electrochemical Society, Inc.",

number = "32",

note = "PRiME 2012 ; Conference date: 07-10-2012 Through 12-10-2017",

}