Preface: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7

K. Kondo, S. Mathad, R. Akolkar, W.P. Dow, H. Philipsen, M. Hayase, M. Koyanagi, Y. Kaneko, F. Roozeboom

Research output: Contribution to journalEditorialAcademicpeer-review

Original languageEnglish
Pages (from-to)III-IV
JournalECS Transactions
Volume69
Issue number6
Publication statusPublished - 11 Oct 2015
Event228th Electrochemical Society Meeting (ECS 2015) - Phoenix, AZ , United States
Duration: 11 Oct 201515 Oct 2015
Conference number: 228
https://www.electrochem.org/228

Cite this

Kondo, K., Mathad, S., Akolkar, R., Dow, W. P., Philipsen, H., Hayase, M., Koyanagi, M., Kaneko, Y., & Roozeboom, F. (2015). Preface: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 . ECS Transactions, 69(6), III-IV.