Preface: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7

K. Kondo, S. Mathad, R. Akolkar, W.P. Dow, H. Philipsen, M. Hayase, M. Koyanagi, Y. Kaneko, F. Roozeboom

Research output: Contribution to journalEditorialAcademicpeer-review

Original languageEnglish
Pages (from-to)III-IV
JournalECS Transactions
Issue number6
Publication statusPublished - 11 Oct 2015
Event228th Electrochemical Society Meeting (ECS 2015) - Phoenix, AZ , United States
Duration: 11 Oct 201515 Oct 2015
Conference number: 228

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