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Preface: Processing, Materials, and Integration of Damascene and 3D Interconnects

  • J. C. Flake
  • , F. Roozeboom
  • , P. Ramm
  • , G. S. Mathad
  • , H. S. Rathore
  • , O. M. Leonte

Research output: Contribution to journalEditorialAcademicpeer-review

Original languageEnglish
JournalECS Transactions
Volume25
Issue number38
Publication statusPublished - 1 Dec 2010
EventProcessing, Materials and Integration of Damascene and 3D Interconnects - 216th ECS Meeting - Vienna, Austria
Duration: 4 Oct 20099 Oct 2009

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