Preface: Processing, Materials, and Integration of Damascene and 3D Interconnects

J. C. Flake; F. Roozeboom; P. Ramm; G. S. Mathad; H. S. Rathore; O. M. Leonte

Preface: Processing, Materials, and Integration of Damascene and 3D Interconnects

J. C. Flake, F. Roozeboom, P. Ramm, G. S. Mathad, H. S. Rathore, O. M. Leonte

Plasma & Materials Processing

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Journal	ECS Transactions
Volume	25
Issue number	38
Publication status	Published - 1 Dec 2010
Event	Processing, Materials and Integration of Damascene and 3D Interconnects - 216th ECS Meeting - Vienna, Austria Duration: 4 Oct 2009 → 9 Oct 2009

Cite this

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title = "Preface: Processing, Materials, and Integration of Damascene and 3D Interconnects ",

author = "Flake, {J. C.} and F. Roozeboom and P. Ramm and Mathad, {G. S.} and Rathore, {H. S.} and Leonte, {O. M.}",

year = "2010",

month = dec,

day = "1",

language = "English",

volume = "25",

journal = "ECS Transactions",

issn = "1938-5862",

publisher = "Electrochemical Society, Inc.",

number = "38",

note = "Processing, Materials and Integration of Damascene and 3D Interconnects - 216th ECS Meeting ; Conference date: 04-10-2009 Through 09-10-2009",

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TY - JOUR

T1 - Preface

T2 - Processing, Materials and Integration of Damascene and 3D Interconnects - 216th ECS Meeting

AU - Flake, J. C.

AU - Roozeboom, F.

AU - Ramm, P.

AU - Mathad, G. S.

AU - Rathore, H. S.

AU - Leonte, O. M.

PY - 2010/12/1

Y1 - 2010/12/1

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UR - http://ecst.ecsdl.org/content/25/38

M3 - Editorial

AN - SCOPUS:79952756347

SN - 1938-5862

VL - 25

JO - ECS Transactions

JF - ECS Transactions

IS - 38

Y2 - 4 October 2009 through 9 October 2009

ER -

Preface: Processing, Materials, and Integration of Damascene and 3D Interconnects

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