3-dimensional integration (3D IC) is a system level architecture/technology wherein multiple layers of planar devices are stacked and vertically interconnected through the silicon substrate (or other semiconductor material) in the Z direction as shown in Figure 1.
|Title of host publication||Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A|
|Place of Publication||Pennington (NJ), USA|
|Publisher||Electrochemical Society, Inc.|
|Publication status||Published - 2009|
|Name||Materials Research Society Symposium Proceedings|