Preface : Materials and Technologies for 3-D Integration - 2008 MRS Fall Meeting; Boston, MA; 1 December 2008 through 3 December 2008

F. Roozeboom, C.A. Bower, P.E. Garrou, M. Koyanagi, P. Ramm

Research output: Chapter in Book/Report/Conference proceedingForeword/postscriptAcademic

1 Downloads (Pure)

Abstract

3-dimensional integration (3D IC) is a system level architecture/technology wherein multiple layers of planar devices are stacked and vertically interconnected through the silicon substrate (or other semiconductor material) in the Z direction as shown in Figure 1.
Original languageEnglish
Title of host publicationMaterials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A
Place of PublicationPennington (NJ), USA
PublisherElectrochemical Society, Inc.
PagesXI-XII
ISBN (Print)978-1-605-11084-4
Publication statusPublished - 2009

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1112
ISSN (Print)0272-9172

Fingerprint Dive into the research topics of 'Preface : Materials and Technologies for 3-D Integration - 2008 MRS Fall Meeting; Boston, MA; 1 December 2008 through 3 December 2008'. Together they form a unique fingerprint.

Cite this