Preface

F. Roozeboom; P.J. Timans; K. Kakushima; H. Jagannathan; Z. Karim; E. P. Gusev; S. De Gendt

Preface

F. Roozeboom
, P.J. Timans
, K. Kakushima
, H. Jagannathan
, Z. Karim
, E. P. Gusev
, S. De Gendt

Plasma & Materials Processing

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Pages (from-to)	iii
Number of pages	1
Journal	ECS Transactions
Volume	85
Issue number	6
Publication status	Published - 1 Jan 2018
Event	International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 8 - 233rd ECS Meeting - Seattle, United States Duration: 13 May 2018 → 17 May 2018

Cite this

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title = "Preface",

author = "F. Roozeboom and P.J. Timans and K. Kakushima and H. Jagannathan and Z. Karim and Gusev, \{E. P.\} and \{De Gendt\}, S.",

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note = "International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 8 - 233rd ECS Meeting ; Conference date: 13-05-2018 Through 17-05-2018",

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TY - JOUR

T1 - Preface

AU - Roozeboom, F.

AU - Timans, P.J.

AU - Kakushima, K.

AU - Jagannathan, H.

AU - Karim, Z.

AU - Gusev, E. P.

AU - De Gendt, S.

PY - 2018/1/1

Y1 - 2018/1/1

UR - https://www.scopus.com/pages/publications/85050075547

M3 - Editorial

AN - SCOPUS:85050075547

SN - 1938-5862

VL - 85

SP - iii

JO - ECS Transactions

JF - ECS Transactions

IS - 6

T2 - International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 8 - 233rd ECS Meeting

Y2 - 13 May 2018 through 17 May 2018

ER -

Preface

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