Original language | English |
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Journal | ECS Transactions |
Volume | 41 |
Issue number | 43 |
Publication status | Published - 1 Dec 2012 |
Event | Processing Materials of 3D Interconnects, Damascene and Electronics Packaging - 220th ECS Meeting - Boston, MA, United States Duration: 9 Oct 2011 → 14 Oct 2011 |
Preface
K. Kondo, R. N. Akolkar, D. Misra, F. Roozeboom, M. Koyanagi
Research output: Contribution to journal › Editorial › Academic › peer-review