Preface

K. Kondo; R. N. Akolkar; D. Misra; F. Roozeboom; M. Koyanagi

Preface

K. Kondo, R. N. Akolkar, D. Misra, F. Roozeboom, M. Koyanagi

Plasma & Materials Processing

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Journal	ECS Transactions
Volume	41
Issue number	43
Publication status	Published - 1 Dec 2012
Event	Processing Materials of 3D Interconnects, Damascene and Electronics Packaging - 220th ECS Meeting - Boston, MA, United States Duration: 9 Oct 2011 → 14 Oct 2011

Cite this

@article{491049ce63f941df8156f3f3c277cd9d,

title = "Preface",

author = "K. Kondo and Akolkar, {R. N.} and D. Misra and F. Roozeboom and M. Koyanagi",

year = "2012",

month = dec,

day = "1",

language = "English",

volume = "41",

journal = "ECS Transactions",

issn = "1938-6737",

publisher = "Electrochemical Society, Inc.",

number = "43",

note = "Processing Materials of 3D Interconnects, Damascene and Electronics Packaging - 220th ECS Meeting ; Conference date: 09-10-2011 Through 14-10-2011",

}

TY - JOUR

T1 - Preface

AU - Kondo, K.

AU - Akolkar, R. N.

AU - Misra, D.

AU - Roozeboom, F.

AU - Koyanagi, M.

PY - 2012/12/1

Y1 - 2012/12/1

UR - http://www.scopus.com/inward/record.url?scp=84879329437&partnerID=8YFLogxK

M3 - Editorial

AN - SCOPUS:84879329437

VL - 41

JO - ECS Transactions

JF - ECS Transactions

SN - 1938-6737

IS - 43

T2 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging - 220th ECS Meeting

Y2 - 9 October 2011 through 14 October 2011

ER -

Preface

Other files and links

Cite this