Preface

K. Kondo, R. N. Akolkar, D. Misra, F. Roozeboom, M. Koyanagi

Research output: Contribution to journalEditorialAcademicpeer-review

Original languageEnglish
JournalECS Transactions
Volume41
Issue number43
Publication statusPublished - 1 Dec 2012
EventProcessing Materials of 3D Interconnects, Damascene and Electronics Packaging - 220th ECS Meeting - Boston, MA, United States
Duration: 9 Oct 201114 Oct 2011

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