Preface

F. Roozeboom; V. Narayanan; K. Kakushima; H. Iwai; D. L. Kwong; P. J. Timans; E. P. Gusev

Preface

F. Roozeboom
, V. Narayanan
, K. Kakushima
, H. Iwai
, D. L. Kwong
, P. J. Timans
, E. P. Gusev

Plasma & Materials Processing

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Pages (from-to)	iii-iv
Journal	ECS Transactions
Volume	53
Issue number	3
Publication status	Published - 21 Oct 2013
Event	International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3 - 223rd ECS Meeting - Toronto, ON, Canada Duration: 12 May 2013 → 17 May 2013

Cite this

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title = "Preface",

author = "F. Roozeboom and V. Narayanan and K. Kakushima and H. Iwai and Kwong, \{D. L.\} and Timans, \{P. J.\} and Gusev, \{E. P.\}",

year = "2013",

month = oct,

day = "21",

language = "English",

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journal = "ECS Transactions",

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publisher = "Electrochemical Society, Inc.",

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note = "International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3 - 223rd ECS Meeting ; Conference date: 12-05-2013 Through 17-05-2013",

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TY - JOUR

T1 - Preface

AU - Roozeboom, F.

AU - Narayanan, V.

AU - Kakushima, K.

AU - Iwai, H.

AU - Kwong, D. L.

AU - Timans, P. J.

AU - Gusev, E. P.

PY - 2013/10/21

Y1 - 2013/10/21

UR - https://www.scopus.com/pages/publications/84885581259

M3 - Editorial

AN - SCOPUS:84885581259

SN - 1938-5862

VL - 53

SP - iii-iv

JO - ECS Transactions

JF - ECS Transactions

IS - 3

T2 - International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3 - 223rd ECS Meeting

Y2 - 12 May 2013 through 17 May 2013

ER -

Preface

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