Preface

F. Roozeboom; V. Narayanan; K. Kakushima; H. Iwai; D. L. Kwong; P. J. Timans; E. P. Gusev

Preface

F. Roozeboom, V. Narayanan, K. Kakushima, H. Iwai, D. L. Kwong, P. J. Timans, E. P. Gusev

Plasma & Materials Processing

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Pages (from-to)	iii-iv
Journal	ECS Transactions
Volume	53
Issue number	3
Publication status	Published - 21 Oct 2013
Event	International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3 - 223rd ECS Meeting - Toronto, ON, Canada Duration: 12 May 2013 → 17 May 2013

Cite this

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title = "Preface",

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TY - JOUR

T1 - Preface

AU - Roozeboom, F.

AU - Narayanan, V.

AU - Kakushima, K.

AU - Iwai, H.

AU - Kwong, D. L.

AU - Timans, P. J.

AU - Gusev, E. P.

PY - 2013/10/21

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M3 - Editorial

AN - SCOPUS:84885581259

SN - 1938-5862

VL - 53

SP - iii-iv

JO - ECS Transactions

JF - ECS Transactions

IS - 3

T2 - International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3 - 223rd ECS Meeting

Y2 - 12 May 2013 through 17 May 2013

ER -

Preface

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