Preface

W. P. Dow; K. Kondo; M. Hayase; U. Cvelbar; F. Roozeboom

Preface

W. P. Dow
, K. Kondo
, M. Hayase
, U. Cvelbar
, F. Roozeboom

Plasma & Materials Processing

Research output: Contribution to journal › Editorial › Academic › peer-review

Original language	English
Number of pages	1
Journal	ECS Transactions
Volume	92
Issue number	5
Publication status	Published - 1 Jan 2019
Event	International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2 - 236th ECS Meeting - Atlanta, United States Duration: 13 Oct 2019 → 17 Oct 2019

Cite this

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title = "Preface",

author = "Dow, \{W. P.\} and K. Kondo and M. Hayase and U. Cvelbar and F. Roozeboom",

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language = "English",

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journal = "ECS Transactions",

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publisher = "Electrochemical Society, Inc.",

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note = "International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2 - 236th ECS Meeting ; Conference date: 13-10-2019 Through 17-10-2019",

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TY - JOUR

T1 - Preface

AU - Dow, W. P.

AU - Kondo, K.

AU - Hayase, M.

AU - Cvelbar, U.

AU - Roozeboom, F.

PY - 2019/1/1

Y1 - 2019/1/1

UR - https://www.scopus.com/pages/publications/85076965389

M3 - Editorial

AN - SCOPUS:85076965389

SN - 1938-5862

VL - 92

JO - ECS Transactions

JF - ECS Transactions

IS - 5

T2 - International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2 - 236th ECS Meeting

Y2 - 13 October 2019 through 17 October 2019

ER -

Preface

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